Production method for metalized counterbore bottom non-metallization

Abstract

The invention discloses a metallized counterbore bottom non-metallization production method, which is characterized by comprising the following steps: S1, drilling a counterbore: drilling the counterbore at a preset position of a circuit board, and then drilling a frustum hole with a vertical section included angle of 90 degrees and a bottom of a circular step at the bottom of the counterbore by adopting a depth control drill; s2, copper deposition: performing copper deposition treatment on the circuit board in the step S1, so that a copper layer is formed in the counterbore and the frustum hole; s3, laying an outer-layer circuit: laying the outer-layer circuit on the circuit board in the step S2; s4, electroplating copper and tin: electroplating the circuit board, so that a copper layer and a tin layer are sequentially formed in the outer-layer circuit, the counterbore and the frustum hole; s5, depth-controlled milling treatment is conducted, specifically, a depth-controlled milling technology is adopted, and the plating layer on the frustum hole is removed; and S6, etching: carrying out etching treatment on the circuit board in the step S5, and etching off the upwarped copper sheet in the depth control gong processing process. The process is simple, machining is convenient, the tin melting quality risk can be effectively reduced, and the product machining efficiency and the product yield are effectively improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a non-metallized production method at the bottom of a metallized counterbore. Background technique [0002] Circuit board, also known as printed circuit board, also known as PCB or printed circuit board, is one of the important components of the electronics industry, almost every kind of electronic equipment, ranging from electronic watches, calculators, to computers, communication electronic equipment, military For weapon systems, as long as there are electronic components such as integrated circuits, printed boards must be used for the electrical interconnection between the various components. Common circuit boards generally include single-sided boards, double-sided boards, and multi-layer boards. In the production of circuit boards, there are often special requirements, such as metalized sink holes. [0003] The metalized sink hole is to process the sink hole on the c...

AI Technical Summary

Problems solved by technology

When making metallized sink holes, it is generally necessary to carry out two controlled depth drilling and one controlled depth gong process. However, due to the limitation of the existing process, the second controlled depth drilled and controlled depth gong process must be performed after electroplating copper and tin. Complete within 24 hours after

Due to the relatively low efficiency of controlled-depth drilling, and two times of controlled-depth drilling will inevitably lead to an increase in material costs and labor costs, and there is a risk of melting tin quality, which is prone to problems such as poor metallization of countersunk holes

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