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Magnetic field induced arrangement carbon fiber heat conduction material and preparation method thereof

A heat-conducting material and carbon fiber technology, applied in the field of thermal management, can solve the problems of high axial thermal conductivity of carbon fibers, disorderly arrangement of carbon fibers, and inability to give full play to the excellent performance of high axial thermal conductivity of carbon fibers, etc. The preparation method is simple, convenient and easy The effect of promotion

Pending Publication Date: 2022-05-10
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the axial thermal conductivity of carbon fiber is higher and the radial thermal conductivity is lower
Generally, the arrangement of carbon fibers in carbon fiber composite materials is disorderly, and the excellent performance of high axial thermal conductivity of carbon fibers cannot be fully utilized. The thermal conductivity of carbon fiber composite materials is only 1~5W / (m·K)

Method used

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  • Magnetic field induced arrangement carbon fiber heat conduction material and preparation method thereof

Examples

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preparation example Construction

[0025] The preparation process of the aligned carbon fiber heat conducting material is as follows:

[0026] a. Add 60% carbon fiber and 5% to 15% film-forming agent into the polyvinyl alcohol solution, perform mechanical stirring, and ultrasonically disperse;

[0027] b. Transfer the mixture to a glass or other non-magnetic container;

[0028] c. The container and the mixture are transferred to the magnetic field, a certain surface of the container is perpendicular to the direction of the magnetic field, the mixture changes from liquid to solid, and moves out of the magnetic field;

[0029] d. Transfer the solid mixture to an electric constant temperature blast drying oven for further heating and curing.

[0030] e. The thermal conductivity of highly oriented carbon fiber thermal conductive material reaches 65W / (m·K).

Embodiment 1

[0033] A heat-conducting material with aligned carbon fibers, including 10% carbon fibers, 84% vinyl silicone oil, 5% curing agent, and 1% catalyst. The carbon fiber has a diameter of 10 μm and a length of 25 μm.

Embodiment 2

[0035] A thermally conductive material with aligned carbon fibers, comprising 5% carbon fibers, 85% polyvinyl alcohol, and 10% film-forming agent. The fiber has a diameter of 5 μm and a length of 200 μm.

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Abstract

The invention discloses a magnetic field induced arrangement carbon fiber heat conduction material and a preparation method thereof, and relates to the technical field of heat management. The magnetic field induced arrangement carbon fiber heat conduction material comprises, by mass, 5-80% of carbon fibers, 10-85% of a polymer matrix, 5-15% of a curing agent, 5-15% of a film forming agent and 0.1-1% of a catalyst. The method comprises the following steps: adding 5-80% of carbon fibers into a polymer matrix, and carrying out mechanical stirring and ultrasonic dispersion to obtain a dispersion; adding a film-forming agent and a catalyst into the dispersion, and then carrying out mechanical stirring for less than or equal to 1 min to obtain a mixture; transferring the mixture into a glass or other non-magnetic container; the container and the mixture are transferred into a magnetic field, one surface of the container is perpendicular to the magnetic induction intensity direction, the mixture is changed into a solid state from a liquid state, and the mixture is moved out of the magnetic field; and transferring the solid mixture to an electrothermal constant-temperature blast drying box, and further heating and curing to obtain the directionally-arranged carbon fiber heat-conducting material.

Description

technical field [0001] The invention relates to the technical field of heat management, in particular to a magnetic field induced arrangement carbon fiber heat conduction material and a preparation method thereof. Background technique [0002] With the gradual increase in the density of electronic devices, the issue of heat conduction has become a topic of concern in the field of materials and electronics industries. Thermal interface materials connect devices and heat sinks and become the key to heat conduction of devices. At present, the main thermal interface materials used are thermal conductive silicone grease, thermal pads, etc. Most of them use metal nitrides, metal oxides, etc. Material. In addition, with the rapid development of lightweight, polymers have replaced traditional metal materials in many occasions. However, polymers have low thermal conductivity, which affects their applications. It is urgent to solve the problem of low thermal conductivity. [0003] M...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L29/04C08K7/06C08J3/28C09K5/14
CPCC08K7/06C08J3/28C09K5/14C08J2383/07C08J2329/04C08L83/04C08L29/04
Inventor 张学骜程书建郭晓晓蔡加法林明源
Owner XIAMEN UNIV
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