Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polyimide film, polyamic acid, varnish containing same, polyimide laminate, and method for producing same

A polyimide film, polyamic acid technology, applied in chemical instruments and methods, coatings, layered products, etc., can solve problems such as inability to withstand film-forming temperature, and achieve the effect of high transparency and less coloring

Pending Publication Date: 2022-05-10
MITSUI CHEM INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the film-forming temperature of conventional polyimide is about 300°C. If such polyimide is to be coated and formed into a film, there is a problem that the object to be coated (for example, a substrate, etc.) cannot withstand the film-forming temperature. Membrane Temperature Questions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide film, polyamic acid, varnish containing same, polyimide laminate, and method for producing same
  • Polyimide film, polyamic acid, varnish containing same, polyimide laminate, and method for producing same
  • Polyimide film, polyamic acid, varnish containing same, polyimide laminate, and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0087] (Preparation of polyamic acid or block polyamic acid imide)

[0088] When the polyimide to be produced is a random polymer, the tetracarboxylic dianhydride component and the diamine component are mixed and polymerized to obtain a polyamic acid. Here, the ratio (y / x) of the total molar weight x of the diamine component to the total molar weight y of the tetracarboxylic dianhydride component when preparing the polyamic acid is preferably 0.970 to 1.100, more preferably 0.990 to 1.010, and further Preferably it is 0.995 to 1.005. By making the diamine component quantity and tetracarboxylic dianhydride component quantity in the said range at the time of preparing a polyamic acid, it becomes easy to set the intrinsic viscosity of the obtained polyamic acid into a desired range.

[0089] The polymerization method of a diamine component and a tetracarboxylic dianhydride component is not specifically limited, A well-known method can be employ|adopted. For example, a container...

Embodiment

[0155] Hereinafter, the present invention will be described in more detail through examples. However, the scope of the present invention is not limited in any way by this example.

[0156] 1. Tetracarboxylic dianhydride components and diamine components

[0157] The abbreviations of the tetracarboxylic dianhydride component and the diamine component used in an Example and a comparative example are as follows, respectively.

[0158] [Tetracarboxylic dianhydride component]

[0159] ODPA: 4,4'-oxydiphthalic anhydride

[0160] s-BPDA: 3,3',4,4'-Biphenyltetracarboxylic dianhydride

[0161] [Diamine component]

[0162] 1,4-BAC: 1,4-bis(aminomethyl)cyclohexane

[0163] HMDA: 1,6-Hexanediamine

[0164] 1. Preparation of polyamic acid varnish

Synthetic example 1

[0166] In a flask including a thermometer, a condenser, a nitrogen inlet tube, and a stirring blade, add 1,4-BAC: 7.11 g (0.050 moles), HMDA: 5.81 g (0.050 moles) and N-methyl-2-pyrrolidone (NMP ): 193.0g, stirred under a nitrogen atmosphere to make a uniform solution. Thereafter, it was cooled to 15° C., s-BPDA: 26.3 g (0.090 mol) and ODPA: 3.10 g (0.010 mol) were charged therein in the form of powder, and stirred as they were. After about 1 hour, heat was gradually generated, and the viscosity was found to increase. This was heated up and reacted at an internal temperature of 60°C to 70°C for 1 hour, resulting in a uniform solution. Thereafter, it was cooled to room temperature and aged overnight at room temperature to obtain a light yellow viscous varnish. The intrinsic viscosity (η) of the obtained polyamic acid varnish (polymer concentration 0.5g / dL, NMP, measured by Ubbelohde's viscosity tube at 25°C) was 1.18dL / g, which was 25 dL / g obtained by an E-type viscometer. T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
thicknessaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The purpose of the present invention is to provide: a polyimide film which can be formed at a relatively low temperature, has little discoloration, and has high transparency; and a polyamic acid or varnish for obtaining the polyimide film. The polyimide film contains a polyimide that is a polymer of a tetracarboxylic dianhydride component and a diamine component. The tetracarboxylic acid dianhydride component contains 60-100 mol% of a tetracarboxylic acid dianhydride having a specific structure with respect to the total amount of the tetracarboxylic acid dianhydride, and the diamine component contains 30-70 mol% of an alicyclic diamine and 30-70 mol% of an alkylene diamine with respect to the total amount of the diamine component.

Description

technical field [0001] The present invention relates to a polyimide film, a polyamic acid, a varnish containing the same, a polyimide laminate, and a method for producing the same. Background technique [0002] Conventionally, epoxy resins and acrylic resins have been known as colorless and transparent coating resins or binder resins. However, these resins have problems in heat resistance and chemical resistance. On the other hand, polyimide is excellent in heat resistance, chemical resistance, mechanical properties, electrical properties, and the like. However, the film-forming temperature of conventional polyimide is about 300°C. If such polyimide is to be coated and formed into a film, the object to be coated (such as a substrate, etc.) may not be able to withstand the film-forming temperature. Membrane temperature problem. [0003] In recent years, studies have been conducted on the use of polyimide, which can be formed into a film at a relatively low temperature, as ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34C08G73/10
CPCC08G73/1053C08G73/1042C08G73/1082C09D179/08C08J5/18C08J2479/08B32B27/34B32B37/06
Inventor 福川健一冈崎真喜浦上达宣久宗穣
Owner MITSUI CHEM INC
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com