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Radiating fin

A technology of heat sink and particle size, which is applied in the direction of modification by conduction and heat transfer, cooling/ventilation/heating transformation, inorganic insulators, etc. It can solve problems such as malfunction of electronic equipment and achieve excellent thermal conductivity and insulation.

Pending Publication Date: 2022-05-10
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the heat generated from the above-mentioned heating element accumulates inside the electronic device, it may cause malfunctions of the electronic device, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0156] [Classification of boron nitride particles]

[0157] Boron nitride particles (HP-40MF100, manufactured by MIZUSHIMA FERROALLOY CO., LTD.) (1) and boron nitride particles (HP-40MF100, manufactured by MIZUSHIMA FERROALLOY CO., LTD.) were classified (classifier: Nisshin The boron nitride particles (2) obtained by Aerofine Classifier manufactured by Engineering Inc., classification condition: D50=62 μm) were kneaded at a ratio of 5:5 (mass ratio) to obtain boron nitride particles (A1).

[0158] [Preparation of Composition (A)]

[0159] Composition (A) was prepared by kneading the following components.

[0160] Monomer (A) (raw material of epoxy resin, QE-2405, manufactured by Combi-Blocks Inc.): 17 parts by mass

[0161] Monomer (B) (raw material of epoxy resin, YX4000, manufactured by Mitsubishi Chemical Corporation): 34 parts by mass

[0162] · Methyl ethyl ketone: 65 parts by mass

[0163] TPP (triphenylphosphine, curing accelerator): 0.5 parts by mass

[0164] · Bo...

Embodiment 2

[0178] [Classification of boron nitride particles]

[0179] The boron nitride particles (1) used in Example 1 were classified by boron nitride particles (HP-40MF100, manufactured by MIZUSHIMA FERROALLOY CO., LTD.) (classifier: Aerofine Classifier manufactured by Nisshin Engineering Inc. , Classification conditions: D50=74 μm) The boron nitride particles (3) obtained were kneaded at a ratio of 5:5 (mass ratio), thereby obtaining boron nitride particles (A2).

[0180] [Production of heat sink]

[0181] Except having changed the boron nitride particle (A1) in the composition (A) into the boron nitride particle (A2), the heat sink was produced by the method similar to Example 1.

Embodiment 3

[0183] [Classification of boron nitride particles]

[0184] The boron nitride particles (1) used in Example 1 were classified by boron nitride particles (HP-40MF100, manufactured by MIZUSHIMA FERROALLOY CO., LTD.) (classifier: Aerofine Classifier manufactured by Nisshin Engineering Inc. , Classification conditions: D50=88 μm) The boron nitride particles (4) obtained were kneaded at a ratio of 5:5 (mass ratio), whereby boron nitride particles (A3) were obtained.

[0185] [Production of heat sink]

[0186]Except having changed the boron nitride particle (A1) in the composition (A) into boron nitride particle (A3), the heat sink was produced by the method similar to Example 1.

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Abstract

Provided is a heat dissipation sheet which contains a resin binder and boron nitride particles, and which is characterized in that: in a particle size distribution based on the number of the boron nitride particles, the particle size D1 when the frequency is maximum is within the range of 60-90 [mu] m; the value obtained by dividing the number of boron nitride particles (A) having a particle diameter in the range of 2-60 [mu] m among the boron nitride particles by the number of boron nitride particles (B) having a particle diameter in the range of 90-150 [mu] m among the boron nitride particles is 2.5-5.0.

Description

technical field [0001] The invention relates to a heat sink. Background technique [0002] With the increase in performance of electronic equipment, it is necessary to efficiently release heat generated in various components constituting the electronic equipment. For example, there are devices that generate heat of 150° C. or higher in power devices, CPU (Central Processing Unit: Central Processing Unit), or light emitting diode (LED: Light Emitting Diode) backlights. When the heat generated from the above-mentioned heating element accumulates inside the electronic device, malfunctions such as malfunction of the electronic device may be caused. Therefore, various techniques have been studied in order to release the heat emitted from the heating element. [0003] For example, a boron nitride agglomerated particle composition is disclosed in Japanese Patent Application Laid-Open No. 2017-36190, the average particle diameter (D 50 ) is 1 μm to 200 μm, and the boron nitride a...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/367H01B3/02H01B3/30C08K3/38C08L101/00
CPCH05K7/20509H01L23/3672H01B3/02H01B3/30C08K3/38C08K2003/285C08L101/00H05K7/20C08K7/04H01L23/36
Inventor 国安谕司佐野贵之
Owner FUJIFILM CORP