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Thermally conductive and insulating composite plastic material and preparation method thereof

A plastic material, heat conduction and insulation technology, applied in the field of heat conduction and insulation composite plastic materials and its preparation, can solve the problems of not being able to have thermal conductivity at the same time, achieve good thermal conductivity and insulation, and good overall performance

Inactive Publication Date: 2016-06-08
SUZHOU FUZHONG PLASTIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some application environments, there are higher requirements for plastic materials, such as improving the heat dissipation and stability of electronic products, these traditional plastic materials are not competent
Pure plastic materials have good insulation, but cannot have good thermal conductivity at the same time. Here, a composite plastic material with both thermal conductivity and insulation and its preparation method are provided

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The heat-conducting and insulating composite plastic material of this embodiment has the following components and parts by mass: 30 parts of urea-melamine resin, 14 parts of hydrogenated rosin resin, 4 parts of silicone resin, 9 parts of polysulfide rubber, 6 parts of polyphenylene sulfide, 5 parts of hectorite, 6 parts of nano-zinc-manganese powder, 3 parts of nano-silicon aluminum powder, 1 part of nano-silicon carbide, 3 parts of basalt fiber, 8 parts of hydrogenated naphthenic oil, 2 parts of azobisisobutyronitrile, 6 parts of dispersant parts, 5 parts of compatibilizer.

[0020] Wherein, the particle size of the nano-zinc-manganese powder is 100nm, and the mass ratio of zinc-manganese in the nano-zinc-manganese powder is 41:59.

[0021] The dispersant is a mixture of polyethylene wax, sodium hexametaphosphate and hydroxypropyl methylcellulose, and its corresponding mass ratio is 4:1:2.

[0022] The compatibilizer is a composite of maleic anhydride grafted ethylene...

Embodiment 2

[0028] The heat-conducting and insulating composite plastic material of this embodiment has the following components and parts by mass: 52 parts of urea melamine resin, 28 parts of hydrogenated rosin resin, 10 parts of silicone resin, 17 parts of polysulfide rubber, 13 parts of polyphenylene sulfide, 14 parts of laponite, 13 parts of nano-zinc-manganese powder, 9 parts of nano-silicon aluminum powder, 5 parts of nano-silicon carbide, 7 parts of basalt fiber, 15 parts of hydrogenated naphthenic oil, 5 parts of azobisisobutyronitrile, and 11 parts of dispersant parts, compatibilizer 11 parts.

[0029] Wherein, the particle size of the nano-zinc-manganese powder is 500nm, and the mass ratio of zinc-manganese in the nano-zinc-manganese powder is 41:59.

[0030] The dispersant is a mixture of polyethylene wax, sodium hexametaphosphate and hydroxypropyl methylcellulose, and its corresponding mass ratio is 4:1:2.

[0031] The compatibilizer is a composite of maleic anhydride grafted...

Embodiment 3

[0037] The heat-conducting and insulating composite plastic material of this embodiment has the following components and parts by mass: 41 parts of urea-melamine resin, 21 parts of hydrogenated rosin resin, 7 parts of silicone resin, 13 parts of polysulfide rubber, 10 parts of polyphenylene sulfide, 10 parts of laponite, 9 parts of nano-zinc-manganese powder, 6 parts of nano-silicon-aluminum powder, 3 parts of nano-silicon carbide, 5 parts of basalt fiber, 12 parts of hydrogenated naphthenic oil, 3 parts of azobisisobutyronitrile, 8 parts of dispersant 8 parts, compatibilizer.

[0038] Wherein, the particle size of the nano-zinc-manganese powder is 300nm, and the mass ratio of zinc-manganese in the nano-zinc-manganese powder is 41:59.

[0039] The dispersant is a mixture of polyethylene wax, sodium hexametaphosphate and hydroxypropyl methylcellulose, and its corresponding mass ratio is 4:1:2.

[0040] The compatibilizer is a composite of maleic anhydride grafted ethylene copo...

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Abstract

The invention provides a thermally conductive and insulating composite plastic material. The thermally conductive and insulating composite plastic material is prepared from components in parts by mass as follows: urea formaldehyde melamine resin, hydrogenated rosin resin, silicone resin, polysulfide rubber, polyphenylene sulfide, hectorite, nano-zinc-manganese powder, nano-silicon-aluminum powder, nano silicon carbide, basalt fibers, hydrogenated naphthenic oil, azodiisobutyronitrile, a dispersing agent and a compatilizer. The invention further provides a preparation method of the thermally conductive and insulating composite plastic material. The thermal conductivity coefficient of the prepared composite plastic material is higher than 1.5 W / m*K, the volume resistivity is higher than 8.9*10<11> omega*m, and the material has both good thermal conductivity and insulativity; meanwhile, test results prove that the tensile strength of the material is higher than 10 MPa, and the material has good combination property.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a heat-conducting and insulating composite plastic material and a preparation method thereof. Background technique [0002] Plastic materials are widely used in the electronic field due to their light weight and good insulation properties. However, electronic products tend to be more and more miniaturized. With the higher integration of electronic products, the requirements for composite plastic substrate materials are also getting higher and higher. Plastic materials are inherently insulating and poor conductors of electricity, but because of this, plastics are also poor conductors of heat. Typically, the thermal conductivity of plastic is about 1 / 500 of that of metal. In some application environments, higher requirements are placed on plastic materials, such as improving the heat dissipation and stability of electronic products, and these traditional plastic materia...

Claims

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Application Information

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IPC IPC(8): C08L61/30C08L93/04C08L83/04C08L81/04C08L81/02C08L51/06C08L53/00C08K13/04C08K7/10C08K3/34C08K3/08
CPCC08L61/30C08K2201/003C08K2201/011C08K2201/014C08L2205/035C08L93/04C08L83/04C08L81/04C08L81/02C08L51/06C08L53/00C08K13/04C08K7/10C08K3/34C08K2003/0893C08K3/08
Inventor 史闵新
Owner SUZHOU FUZHONG PLASTIC CO LTD