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Method and device for 3D printing of thermosetting material or photosensitive material

A 3D printing, photosensitive material technology, applied in the field of thermosetting material or photosensitive material 3D printing and device, can solve the problem of limiting the application of thermosetting resin, avoid thermal degradation risk and loss, improve performance, and obvious economic effects

Pending Publication Date: 2022-05-13
SHANGHAI UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are currently few methods and processes suitable for 3D printing of thermosetting resins, which greatly limits the application of thermosetting resins in the field of 3D printing.

Method used

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  • Method and device for 3D printing of thermosetting material or photosensitive material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this embodiment, a method and device for 3D printing of thermosetting materials are provided. The raw material used in this embodiment is a thermosetting material, so that the thermosetting resin has a certain fluidity in the nozzle of the 3D printer, and then the resin on the working platform is cured with a laser. The present invention uses thermosetting plastics as raw materials to carry out 3D printing, which can promote the deep development of 3D printing technology, so that thermosetting plastics can be applied to more products.

[0030] The thermosetting resin 3D printing device of this embodiment implements the method of thermosetting resin 3D printing of the present invention, including a feeding system, a 3D printer nozzle, a temperature control device, a laser device and a workbench, and the resin is passed through a delivery pipeline and a computer control valve. The feeding system enters the nozzle of the printer, and the temperature is controlled by the...

Embodiment 2

[0033] This embodiment is basically the same as Embodiment 1, especially in that:

[0034] In this example, see figure 1, the resin used is bisphenol A epoxy resin E51, and the curing agent is dicyandiamide. The epoxy resin and dicyandiamide are transported from the feed port to the barrel for mixing according to a certain ratio, the screw temperature is set at 55-60°C, and the extrusion rate is set at 0.2m / s, so that E51 has a flow in the screw nozzle. properties, and the dicyandiamide curing epoxy resin condition is 150 ~ 170 ℃, so the resin will not solidify at the nozzle and block the nozzle. As the raw materials are continuously conveyed to the barrel, the resin is also continuously extruded and accumulated on the workbench, and solidified and formed under laser heating to obtain epoxy resin 3D printed products. The tensile strength of the obtained 3D printed products can reach Up to 100MPa.

[0035] At present, the most commonly used printing material in the tradition...

Embodiment 3

[0037] This embodiment is basically the same as the above-mentioned embodiment, and the special features are:

[0038] In this example, see figure 1 , the resin used is bisphenol A type epoxy resin E20, and the curing agent is phthalic anhydride. A certain ratio of epoxy resin and phthalic anhydride is transported from the feed port to the barrel for mixing, the screw temperature is set at 40-60°C, and the extrusion speed is set at 0.1m / s, so that E20 has a Fluidity, and the melting point of phthalic anhydride is 128 ° C, so the resin will not solidify at the nozzle and block the nozzle. As the raw materials are continuously conveyed to the barrel, the resin is also continuously extruded and accumulated on the workbench. It is cured and formed under laser heating to obtain epoxy resin 3D printed products with a tensile strength of up to 80MPa.

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Abstract

The invention discloses a method and a device for 3D printing of a thermosetting material or a photosensitive material, which are used for 3D printing of thermosetting resin and comprise a thermosetting resin 3D printing device and a 3D printing material laser thermocuring method. Resin, a curing agent and other auxiliaries are evenly mixed through the screw in the charging barrel and conveyed to the front-end printer nozzle to be sprayed out, then the resin on the working platform is cured and formed through light beams, the screw and the light beams synchronously and accurately move under the control of a computer, printing is conducted layer by layer, and a thermosetting 3D printed part is formed. The thermosetting resin is used as a raw material for 3D printing, the deep development of the 3D printing technology is promoted, and the application of the thermosetting resin in 3D printed parts is expanded. According to the method, the thermal degradation risk and loss caused by repeated melting of resin in existing 3D printing technologies such as FDM are avoided, the technological method for preparing the thermosetting material 3D printed part under a common spray head is achieved, and the performance of the 3D printed part is improved.

Description

technical field [0001] The invention relates to a thermosetting resin 3D printing process method and equipment, which use heat-curable or light-curable resin raw materials in the technical field of 3D printing. Background technique [0002] With the rapid development of 3D printing technology, various 3D printing processes and 3D printing equipment emerge in an endless stream, among which the common ones are fused deposition modeling (FDM), stereolithography (SLA), selective laser sintering (SLS) and so on. There are obvious defects and deficiencies in the above printing processes: [0003] 1. For FDM 3D printing parts, most of the printing consumables used are thermoplastic resin filament materials. The printing process is only the physical melting-cooling and solidification process of the resin. It cannot be used for thermosetting resin 3D printing, and the finished resin product has undergone secondary or even Repeated melting may cause structural damage and performance ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/124B29C64/20B29C64/393B33Y10/00B33Y30/00B33Y50/02
CPCB29C64/124B29C64/20B29C64/393B33Y10/00B33Y30/00B33Y50/02
Inventor 刘海彬汪恒张晓军李启航韩民峰毕宸洋贾浩洋
Owner SHANGHAI UNIV
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