Diffusion method of imbricated solar cell and imbricated solar cell
A technology of a solar cell and a diffusion method is applied to the diffusion method of a shingled solar cell and the field of a shingled solar cell, and achieves the effects of improving the junction depth and breakdown voltage of a PN junction and improving the photoelectric conversion efficiency.
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Embodiment 1
[0039] In the diffusion method for shingled solar cells according to the embodiment of the present application, when the resistivity of the silicon wafer is greater than or equal to the preset resistivity threshold value, the silicon wafer after the phosphorus deposition treatment is subjected to a first preset number of advance treatments; When the resistivity of the silicon wafer is less than the preset resistivity threshold, the silicon wafer after the phosphorus deposition process is subjected to a second preset number of advance treatments.
[0040] The diffusion method of the shingled solar cell in the embodiment of the present application, because silicon wafers with different resistivities are subjected to different times of advancing treatment, thereby performing selective diffusion, it is possible to improve the performance of the shingled solar cell made of silicon wafers in a targeted manner. The PN junction depth and breakdown voltage improve the photoelectric conv...
Embodiment 2
[0079] In some optional embodiments, the range of the preset resistivity threshold is 0.6Ω·cm-0.8Ω·cm. For example, it is 0.6Ω·cm, 0.62Ω·cm, 0.65Ω·cm, 0.68Ω·cm, 0.7Ω·cm, 0.73Ω·cm, 0.75Ω·cm, 0.79Ω·cm, 0.8Ω·cm.
[0080] In this way, the preset resistivity threshold is in an appropriate range, and it is difficult to carry out targeted push processing on silicon wafers with different resistivities caused by the preset resistivity threshold being too low or too high, thereby avoiding the poor effect of the push processing, It is beneficial to improve the PN junction depth and breakdown voltage of shingled solar cells made of silicon wafers in a targeted manner.
[0081] For other explanations and illustrations about this embodiment, reference may be made to other parts of this document, and details are not repeated here to avoid redundancy.
Embodiment 3
[0083] In some optional embodiments, the preset resistivity threshold is 0.7Ω·cm.
[0084] In this way, the silicon wafers with a resistivity greater than or equal to 0.7Ω·cm are subjected to a first preset number of advance treatments, and the silicon wafers with a resistivity less than 0.7Ω·cm are subjected to a second preset number of advance treatments. The classification is more accurate, so that silicon wafers can be targeted for advancing treatment, so that the effect of advancing treatment is better, which is conducive to targeted improvement of the PN junction depth and breakdown voltage of shingled solar cells made of silicon wafers .
[0085] For other explanations and illustrations about this embodiment, reference may be made to other parts of this document, and details are not repeated here to avoid redundancy.
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Abstract
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