Boiling enhanced heat transfer structure and liquid box for cooling high-power-density electrical equipment

Abstract

The invention belongs to the technical field of equipment cooling, particularly relates to a boiling enhanced heat transfer structure and a liquid box for cooling high-power-density power equipment, and aims to solve the heat dissipation problem of the high-power-density power electronic equipment. The boiling enhanced heat transfer structure comprises a plate-shaped body, a first structural section, a second structural section and a third structural section, and the first structural section, the second structural section and the third structural section are sequentially arranged in a covering mode in the longitudinal direction of the plate-shaped body. The second structural section and the first structural section form a lower step structure, and the third structural section and the second structural section form a lower step structure; the first structural section covers the cooling working medium inflow area, and the third structural section covers the cooling working medium outflow area; a first zigzag groove is formed in the outer surface of the first structural section; a second zigzag groove is formed in the outer surface of the second structural section; a third zigzag groove is formed in the outer surface of the third structural section; boiling heat transfer can be effectively enhanced, and the heat dissipation capacity of the liquid box is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of equipment cooling, and in particular relates to a boiling enhanced heat transfer structure and a liquid box for cooling high power density electric equipment. Background technique [0002] With the continuous development of electronic assembly technology, electronic equipment tends to be miniaturized and the system tends to be complicated. On the other hand, users' demands on the performance of power electronic equipment continue to increase. The above two aspects have led to a substantial increase in the heat generation power of power electronic equipment. High-power-density power electronic equipment has higher and higher requirements for heat dissipation capabilities. Traditional air-cooling and water-cooling methods cannot meet the heat dissipation requirements. Thanks to the huge latent heat value of the phase change process, the boiling heat transfer method is widely used in the cooling of high pow...

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Problems solved by technology

When the material of the liquid box is fixed, the means of reducing the temperature difference of heat conduction are limited. For the rapid increase of heat generation power, especially heat flux density, of high-power-density power electronic equipment, the cooling system and coolant box disclosed in the prior art cannot meet its needs.

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