30results about How to "Improve boiling heat transfer capacity" patented technology

The invention discloses a flat-plate heat tube with a nanometer structure. The flat-plate heat tube with the nanometer structure comprises a bottom plate, a top plate and a supporting plate, wherein the supporting plate is positioned between the top plate and the bottom plate; the bottom plate, the top plate and the supporting plate are hermetically connected to one another to form a hollow closed cavity; a body of the bottom plate which serves as an evaporation surface of the flat-plate heat tube is a brass sheet; a copper oxide film which has a nanometer structure, has a super-hydrophilic property and is formed by electrochemical displacement covers the inner surface of the bottom plate; a body of the top plate which serves as a condensation surface of the flat-plate heat tube is a brass sheet; an electro-nickelling layer which has a nanometer structure and has a super-hydrophobic property covers the inner surface of the top plate; and small through holes are formed in a side surface of the supporting plate and are connected with capillary tubes. The evaporation surface and the condensation surface of the flat-plate heat tube are subjected to super-hydrophilic and super-hydrophobic surface modification, the evaporation speed and the condensation speed are increased, the heat exchange performance of an evaporation region and the heat exchange performance of a condensation region are improved, the thermal homogeneity is high, working medium is guided to return, and the working medium returning speed is increased, so that the whole heat exchange capability is improved.

The invention discloses a combined cylindrical chip reinforced boiling heat transfer microstructure and a manufacturing method thereof. The microstructure comprises a heat-dissipation plate arranged on the surface of a chip. The heat-dissipation plate is provided with a plurality of combination units. Each combination unit is formed by five microcolumns. The center of each combination unit is a cylindrical micro-column, and the rest four H-shaped micro-columns are arranged around the cylindrical micro-column symmetrically. The two surfaces of each H-shaped micro-column facing to the cylindrical micro-column and opposite to the cylindrical micro-column are the same parabolic surfaces, and the rest two sides surfaces and the top surface are planes; and every two adjacent combination units share one H-shaped micro-column. The microstructure can greatly increase the number of bubble evaporation cores, and greatly improve nucleate boiling heat transfer performance and critical heat flux density.

The invention discloses a device and method for cooling partial high heat flow within a limited space. The device comprises a lower cover board, a water inlet pipeline, an inlet pipeline connector, a vacuum pumping port, an upper cover board, a supporting column, a containing space, a super-hydrophilic micro-nano structural coating, an evaporation area, a micro-channel tube bundle, an outlet pipeline connector, a water outlet pipeline, a partial heating source, a base board and a micro-channel hole. The micro-channel tube bundle is arranged in the condensation section space of an internal pipe of a guide panel heat pipe, so that the space of a whole cooler device is largely reduced. Due to the arrangement of micro-channel tubes, the cooling superficial area is enlarged, the coefficient of heat exchange is increased through forced convection of water in the micro-channel tubes, and the heat exchange capability of the condensation end is enhanced. The boiling heat exchange capability of the evaporation area is enhanced through the super-hydrophilic micro-nano structural coating, and finally the overall heat exchange capability of the device is enhanced.

The invention provides a porous surface boiling heat exchange enhancement device and a method for manufacturing the same. The porous surface boiling heat exchange enhancement device comprises a heat exchange enhancement device body, a plurality of heat dissipation grooves and a plurality of micro-fins. The heat dissipation grooves are formed in the outer surface of the heat exchange enhancement device body; the corresponding micro-fins are separated from one another, are positioned between each two rows of heat dissipation grooves and are made of shape memory alloy materials, and each micro-fin can be in two states after being trained; the micro-fins in the first states are oblique at the temperature lower than a preset temperature, and cover the upper portions of the heat dissipation grooves, and the heat dissipation grooves are converted into porous grooves; the micro-fins in the second states are tilted at the temperature higher than the preset temperature, the upper portions of the heat dissipation grooves are opened completely or partially, and the heat dissipation grooves are converted into open grooves. The porous surface boiling heat exchange enhancement device and the method have the advantages that the energy utilization efficiency can be improved, the temperature of a heating device can be low under the control of the porous surface boiling heat exchange enhancement device, and the stability and the reliability of equipment can be improved.

The invention relates to a nonuniform wetted surface with a fractal characteristic and a preparation method thereof. The nonuniform wetted surface comprises hydrophobic lattice areas and hydrophilic channels, wherein the hydrophobic lattice areas are distributed according to the fractal characteristic of a Sierpinski carpet curve, and the hydrophilic channels are staggered and pass through the hydrophobic lattice areas so as to form the nonuniform wetted surface. Hydrophobic lattices are distributed according to the fractal characteristic of the Sierpinski carpet curve, so that the boiling heat transfer coefficient is increased, additionally, the nucleating point and the moving and merging direction of steam bubbles can be planned, and the heat flux distribution characteristic in an electronic chip cooling process is combined, so that the forming of the steam bubbles in the high-heat flux density area in the center of a chip and the boiling heat exchange are effectively promoted. The hydrophilic channels can supply sufficient liquid working media, so that the steam bubble film forming is delayed, and the critical heat flux density is increased. The surface has the advantages of high critical heat flux density of hydrophilic areas and high boiling heat transfer coefficient of hydrophobic areas, and the consistent steam bubble distribution and heat flux density distribution of acooling surface can be realized, so that the boiling heat exchange is further intensified.

The invention discloses a spray cooling device combining a steam cavity and a composite microstructure. The device comprises a spray chamber, a spray chamber liquid inlet pipe, a spray chamber liquidoutlet pipe and a steam chamber, wherein the spray chamber and the steam chamber are integrally arranged; the spray chamber comprises a spray orifice plate, array nozzles and a composite microstructure which are positioned in the spray chamber; the spray orifice plate divides the spray chamber into a buffer chamber and a spray chamber; the spray chamber liquid inlet pipe is communicated with the buffer chamber; the spray chamber liquid outlet pipe is communicated with the spray chamber, the composite microstructure is arranged on the wall face, opposite to the array nozzle, in the spray chamber, the composite microstructure comprises a bottom layer liquid absorption core arranged on the wall face opposite to the array nozzle and a plurality of rib-shaped liquid absorption cores arranged onthe bottom layer liquid absorption core, and a phase change working medium is sealed in the steam chamber. The steam chamber expands heat generated by a heat source to the spraying wall face with a large area, the heat exchange performance of the wall face is improved through multi-nozzle array spraying, and the two-phase heat exchange capacity of spraying is improved through combination of the steam chamber and a composite microstructure enhanced heat transfer mode.