Spray cooling device combining steam cavity and composite microstructure

Abstract

The invention discloses a spray cooling device combining a steam cavity and a composite microstructure. The device comprises a spray chamber, a spray chamber liquid inlet pipe, a spray chamber liquidoutlet pipe and a steam chamber, wherein the spray chamber and the steam chamber are integrally arranged; the spray chamber comprises a spray orifice plate, array nozzles and a composite microstructure which are positioned in the spray chamber; the spray orifice plate divides the spray chamber into a buffer chamber and a spray chamber; the spray chamber liquid inlet pipe is communicated with the buffer chamber; the spray chamber liquid outlet pipe is communicated with the spray chamber, the composite microstructure is arranged on the wall face, opposite to the array nozzle, in the spray chamber, the composite microstructure comprises a bottom layer liquid absorption core arranged on the wall face opposite to the array nozzle and a plurality of rib-shaped liquid absorption cores arranged onthe bottom layer liquid absorption core, and a phase change working medium is sealed in the steam chamber. The steam chamber expands heat generated by a heat source to the spraying wall face with a large area, the heat exchange performance of the wall face is improved through multi-nozzle array spraying, and the two-phase heat exchange capacity of spraying is improved through combination of the steam chamber and a composite microstructure enhanced heat transfer mode.

Description

technical field [0001] The invention belongs to the technical field of spray cooling, and in particular relates to a spray cooling device combining a steam chamber and a composite microstructure. Background technique [0002] With the development of high performance, high efficiency, high integration and high reliability of aerospace electronic components, the problem of high heat flux and heat dissipation of electronic components follows, especially the heat flux of airborne equipment can reach 100~ 1000W / cm 2 . High heat flux heating problems may cause electronic components to run unstable or even fail. The heat dissipation problem of high heat flux has become one of the technical bottlenecks restricting the development of electronic components. Conventional air natural convection or forced convection heat transfer coefficient is only 2~250W / (m 2 In the range of K), it is difficult to meet the heat dissipation requirements; jet cooling has high heat transfer performanc...

AI Technical Summary

Problems solved by technology

However, due to the complexity of spray cooling heat transfer technology, there are many factors affecting its heat transfer performance.

On the one hand, the high heat flux density of electronic components is likely to cause local drying of the heat transfer surface, which affects the critical heat flux density; on the other hand, the current spray heat transfer surface mostly adopts simple geometric microstructures such as pin ribs and grooves Although the surface heat transfer performance has been improved to a certain extent, the extension ability of the liquid film on the spray surface is not enough to achieve higher heat transfer performance, and it is difficult to meet the heat dissipation requirements of higher heat flux density

Images