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A block-type enhanced boiling heat transfer microstructure and its manufacturing method

A technology of enhancing boiling and partitioning, applied in indirect heat exchangers, lighting and heating equipment, semiconductor devices, etc., to achieve the effect of dense internal microstructure, high heat flux density, and improved heat exchange performance

Active Publication Date: 2020-11-27
西安交通大学深圳研究院
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies and defects of the existing enhanced surface structure for cooling ultra-high heat flux electronic devices, the invention provides a block-type enhanced boiling heat transfer microstructure and its manufacturing method

Method used

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  • A block-type enhanced boiling heat transfer microstructure and its manufacturing method
  • A block-type enhanced boiling heat transfer microstructure and its manufacturing method

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Embodiment Construction

[0028] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0029] see figure 1 and figure 2 , a block-type enhanced boiling heat transfer microstructure, including a heat dissipation plate 1 on the heat exchange surface, a plurality of circular block units 2 are arranged on the heat dissipation plate 1, and each circular block unit 2 is composed of several circles of microstructures. Composed of pillars, the block units 2 are distributed on the cooling plate 1 in a square array, and the length c of the cooling plate 1 is equal to the width e. Each block unit 2 is exactly the same as an element of the array, and the number of rows and columns of the array are equal, the spacing between adjacent block units 2 is equal, and the array can be filled with the cooling plate 1, wherein the block unit 2 The number ranges from 4 to 16, the diameter d of each block unit 2 is 0.25mm-10mm, the distance between adjacent block units 2 is...

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Abstract

The invention discloses a partitioned block type strengthened boiling heat exchange microstructure and a manufacturing method thereof. The heat exchange microstructure comprises a radiating plate, wherein a plurality of circular block units are arranged on the radiating plate, each block unit is composed of a plurality of circles of microcolumns, and the block units are distributed on the radiating plate in an array mode. On the one hand, space distances between gas columns and the radius of the gas columns when heat flux is high can be limited, the merging among the gas columns is prevented,the boiling heat exchange performance of a high heat flux area is remarkably enhanced, and critical heat flux of chip boiling heat exchange is greatly improved; and on the other hand, each block unitis formed by the circular microcolumns which are arranged in a concentric circle, and microcolumn space distances from inner rings to outer rings are sequentially increased, so that flow resistance that fluid is directionally conveyed to a microstructure area from a smooth area is reduced, fresh liquid is timely supplied to the bottom of the of a bubble center under the condition of the high heatflux, the bubble evaporation is maintained, and the critical heat flux is further improved.

Description

technical field [0001] The invention belongs to ultra-high heat flux boiling enhanced heat transfer technology, and relates to a high-efficiency cooling technology suitable for ultra-high heat flux microelectronic devices, in particular to a block-type enhanced boiling heat transfer microstructure and a manufacturing method thereof. Background technique [0002] In recent years, microelectronics processing technology has gradually matured, so the degree of integration of microelectronic devices has become higher and higher, and the heat generation per unit area has also gradually increased. The problem of heat dissipation has become the key to restricting the development of electronic devices. [0003] Boiling heat transfer is an enhanced heat transfer method that immerses microelectronic devices in a non-conductive heat transfer medium for heat transfer. It has the characteristics of high heat flux density and low wall superheat. In recent years, a large number of scholars ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04H01L23/427
CPCF28D15/046H01L23/427
Inventor 张永海雷泽阳刘斌
Owner 西安交通大学深圳研究院
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