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A microscale cooperative surface structure for enhanced boiling heat transfer

A technology that enhances boiling and heat transfer surfaces, applied in the field of enhanced heat transfer, to achieve the effect of promoting detachment and enhancing the effect of boiling heat transfer

Inactive Publication Date: 2020-05-19
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiency of a single microstructure, and propose a microscale synergistic surface structure

Method used

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  • A microscale cooperative surface structure for enhanced boiling heat transfer
  • A microscale cooperative surface structure for enhanced boiling heat transfer
  • A microscale cooperative surface structure for enhanced boiling heat transfer

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Embodiment Construction

[0013] The specific implementation manners of the present invention will be further described below in conjunction with the accompanying drawings and technical solutions.

[0014] Such as Figure 1~3 As shown, a micro-scale cooperative structure of surface enhanced boiling heat transfer, including large groove 1, small groove 2, connecting groove 3, micro-rib 4, base surface 5 and superhydrophobic coating 6; described enhanced boiling structure The surface of the base surface 5 is formed by mechanical cutting, structural electroplating or laser ablation to form a synergistic scale surface; the surface of the base surface 5 is divided by micro-ribs 4 to form large grooves 1, small grooves 2 and connecting grooves 3;

[0015] The large grooves 1 and the small grooves 2 are arranged in a staggered manner, and the large grooves 1 and the small grooves 2 are formed by a plurality of evenly spaced micro-ribs, and the width L3 of the micro-ribs is 50-100 μm; the grooves of the small ...

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Abstract

The invention belongs to the technical field of enhanced heat transfer, and provides a micro-scale collaborative surface structure for enhancing boiling heat transfer. The structure comprises a largegroove, a small groove, a connecting groove, a micro rib, a base surface and a super-hydrophobic coating; the base surface of the structure for enhancing boiling heat transfer is subjected to mechanical cutting, structure electroplating or laser burning to form a synergistic scale surface; the surface of the base surface is divided into the large groove, the small groove and the connecting groovethrough ribs. According to the structure, the micro-scale collaborative surface structure can achieve the capillary force effect, so that a liquid can reach a vaporization core point faster, the requirement of the boiling heat transfer vaporization process on the scale can be further met under the condition of different superheat degrees, the connecting groove between the large groove and the small groove enables liquid between the grooves to interact, so that steam is easier to discharge, and then the boiling heat transfer is enhanced.

Description

technical field [0001] The invention belongs to the technical field of enhanced heat transfer, and designs a micro-scale synergistic surface structure that can regulate the bubble growth process. Background technique [0002] Among the many challenges of meeting the growing global energy demand in a sustainable manner, improving phase-change heat has been at the forefront of engineering research for decades. The high heat transfer rate associated with phase change heat transfer is critical for both energy and industrial applications, but phase change heat transfer suffers from inefficiency in heat transfer at low heat densities. Micro-nano-related technologies can enable surface size structures from molecules to centimeters. These technologies can obtain silicon-based surfaces, sintered structures, and polymeric coatings. Surfaces with different structures can influence the heterogeneous transformation process in practical situations. Boiling heat transfer refers to the va...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F13/00F28F13/18
CPCF28F13/00F28F13/185
Inventor 吕继组白敏丽高林松
Owner DALIAN UNIV OF TECH
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