Surface acoustic wave filter wafer packaging method and chip
A surface acoustic wave and wafer packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, impedance networks, etc., can solve problems such as yield loss, complex process, and packaging failure
Active Publication Date: 2022-05-17
苏州科阳半导体有限公司
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Problems solved by technology
Due to the different materials of the surface acoustic wave filter wafer and the cover wafer, the CTE (coefficient of thermal expansion, coefficient of thermal expansion) of the two differs greatly, and it is easy to break during the bonding process, resulting in packaging failure or yield loss
In addition, in the existing packaging process, the gold-to-gold flip-chip welding process is often used to form the cavity between the surface acoustic wave filter wafer and the cover wafer, which is not only costly but also complicated.
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[0054] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.
[0055] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordin...
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The invention relates to the technical field of surface acoustic wave filters, in particular to a surface acoustic wave filter wafer packaging method which comprises the steps that an electrode and a key function area are arranged on a first surface of a surface acoustic wave filter wafer, the surface acoustic wave filter wafer is provided with a cutting area, and the electrode and the key function area are not in the cutting area; and a modified layer is formed in the cutting area through machining by adopting an invisible laser cutting technology, and the modified layer does not extend to the surface. A to-be-cut area is arranged on the second surface of the cover plate wafer, the to-be-cut area corresponds to the cutting area, and a plurality of protruding blocks are evenly machined in the to-be-cut area at intervals through the photoetching technology. And a glue area is formed on the second surface by adopting a dispensing or printing technology, the glue area corresponds to the area where the electrode is located and does not correspond to the key functional area, and the surface acoustic wave filter wafer and the cover plate wafer are bonded, so that the first surface and the second surface are oppositely arranged. The invention also provides a chip manufactured by using the surface acoustic wave filter wafer packaging method.
Description
technical field [0001] The present invention relates to the technical field of surface acoustic wave filters, in particular to a surface acoustic wave filter wafer packaging method and chip. Background technique [0002] Most of the existing surface acoustic wave filter wafer-level packaging processes first cut the surface acoustic wave filter wafer, and then perform a series of process operations such as bonding. Due to the different materials of the surface acoustic wave filter wafer and the cover wafer, the CTE (coefficient of thermal expansion, coefficient of thermal expansion) of the two differs greatly, and it is easy to break during the bonding process, resulting in packaging failure or yield loss . In addition, in the existing packaging process, a gold-to-gold flip-chip welding process is often used to form a cavity between the surface acoustic wave filter wafer and the cover wafer, which is not only costly but also complicated. [0003] Therefore, there is an urge...
Claims
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Login to View More IPC IPC(8): H01L21/52H01L21/78H03H3/08H03H9/64
CPCH01L21/52H01L21/78H03H3/08H03H9/64
Inventor 朱其壮朱杉陈振国金科吕军
Owner 苏州科阳半导体有限公司