A surface acoustic wave filter wafer packaging method and chip
A surface acoustic wave and wafer packaging technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, impedance networks, etc., can solve problems such as packaging failure, complicated process, and easy fragmentation
Active Publication Date: 2022-07-12
苏州科阳半导体有限公司
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Problems solved by technology
Due to the different materials of the surface acoustic wave filter wafer and the cover wafer, the CTE (coefficient of thermal expansion, coefficient of thermal expansion) of the two differs greatly, and it is easy to break during the bonding process, resulting in packaging failure or yield loss
In addition, in the existing packaging process, the gold-to-gold flip-chip welding process is often used to form the cavity between the surface acoustic wave filter wafer and the cover wafer, which is not only costly but also complicated.
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[0054] The technical solutions of the present invention are further described below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the accompanying drawings only show some but not all of the parts related to the present invention.
[0055] In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. Fo...
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Abstract
The invention relates to the technical field of surface acoustic wave filters, in particular to a surface acoustic wave filter wafer packaging method, comprising: electrodes and key functional areas are arranged on the first surface of a surface acoustic wave filter wafer, and a surface acoustic wave filter wafer is provided with electrodes and key functional areas. The filter wafer is provided with a cutting area, the electrodes and key functional areas are not in the cutting area, and a modified layer is formed in the cutting area by using the invisible laser cutting process, and the modified layer does not extend to the surface. A to-be-cut area is set on the second surface of the cover wafer, the to-be-cut area corresponds to the cut area, and a photolithography process is used to process a plurality of bumps evenly spaced in the to-be-cut area. A glue area is formed on the second surface by a glue dispensing or printing process. The glue area corresponds to the area where the electrodes are located, and does not correspond to the key functional area. The surface acoustic wave filter wafer and the cover wafer are bonded to make the first The surface is disposed opposite to the second surface. The present invention also provides a chip manufactured by using the above-mentioned surface acoustic wave filter wafer packaging method.
Description
technical field [0001] The present invention relates to the technical field of surface acoustic wave filters, in particular to a surface acoustic wave filter wafer packaging method and a chip. Background technique [0002] Most of the existing surface acoustic wave filter wafer-level packaging processes firstly cut the surface acoustic wave filter wafer, and then perform a series of process operations such as bonding. Due to the different materials of the surface acoustic wave filter wafer and the cover wafer, the CTE (coefficient of thermal expansion, coefficient of thermal expansion) of the two is quite different, and it is easy to be broken during the bonding process, resulting in packaging failure or yield loss. . In addition, in the existing packaging process, a process of flip-chip bonding of gold and gold is often used to form a cavity between the surface acoustic wave filter wafer and the cover wafer, which is not only costly but also complicated in process. [000...
Claims
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IPC IPC(8): H01L21/52H01L21/78H03H3/08H03H9/64
CPCH01L21/52H01L21/78H03H3/08H03H9/64
Inventor 朱其壮朱杉陈振国金科吕军
Owner 苏州科阳半导体有限公司