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Gradient transition layer for improving film-substrate bonding strength of high-entropy nitride film and preparation method

A nitride film, gradient transition technology, applied in coating, metal material coating process, vacuum evaporation coating and other directions, can solve the problems of poor film-base bonding force, affecting the service life of the tool, etc., to alleviate the internal stress of the film, The effect of improving the service life and improving the bonding strength of the membrane base

Pending Publication Date: 2022-05-27
XIAN TECHNOLOGICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the poor bonding force between the film prepared by magnetron sputtering technology and the tool substrate has always been the main problem in the preparation of the tool film, which seriously affects the service life of the tool.

Method used

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  • Gradient transition layer for improving film-substrate bonding strength of high-entropy nitride film and preparation method
  • Gradient transition layer for improving film-substrate bonding strength of high-entropy nitride film and preparation method

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preparation example Construction

[0032] The invention discloses a preparation method of a gradient transition layer for improving the bonding strength of a high-entropy nitride film and a film base. A metal layer is deposited on the tool substrate; wherein the metal layer contains at least one metal element in the tool substrate; a metal nitride connection layer is deposited on the metal layer; wherein the metal nitride connection layer includes at least one of the nitride thin film layers A constituent element, and the constituent element is not N element; a nitride thin film layer is deposited on the metal nitride tie layer.

[0033] In the present invention, the metal layer and the metal nitride connection layer are sequentially deposited by the magnetron sputtering method between the tool base and the nitride film layer, and the components in the metal nitride connection layer change continuously, so that the internal stress of the film can be alleviated, The bonding strength of the film base between the ...

Embodiment 1

[0042] In this embodiment, a high-speed steel tool matrix is ​​selected, and the tool matrix contains Cr, and the gradient transition layer is composed of an AlSiTiVNbCr layer and a (AlSiTiVNbCr)N metal nitride connection layer. The specific preparation method is as follows:

[0043] (1) Sample pretreatment: put the high-speed steel tool into acetone for ultrasonic cleaning for 5 minutes, then ultrasonically clean it with deionized water for 2 times, each cleaning for 3 minutes, and finally put it into anhydrous ethanol for ultrasonic cleaning for 2 times, each cleaning for 3 minutes , blow dry for use.

[0044] (2) Preparation of thin film deposition: The cleaned high-speed steel tool is sent into a vacuum chamber equipped with an AlSiTiVNbCr target, the target is connected to a radio frequency power supply, and the target-base distance is 60mm; the vacuum is evacuated to 3×10 -3 After Pa, 60sccm of argon gas was introduced to keep the pressure in the vacuum chamber at about ...

Embodiment 2

[0051] In this embodiment, a high-speed steel tool matrix is ​​selected, and the tool matrix contains Cr, and the gradient transition layer is composed of a metal Cr layer and a CrN layer. The specific preparation method is as follows:

[0052] (1) Sample pretreatment: put the high-speed steel tool into acetone for ultrasonic cleaning for 5 minutes, then ultrasonically clean it with deionized water for 2 times, each cleaning for 3 minutes, and finally put it in anhydrous ethanol for ultrasonic cleaning 2 times, each cleaning for 3 minutes , blow dry for use.

[0053] (2) Preparation of thin film deposition: The cleaned high-speed steel tool is sent into a vacuum chamber equipped with AlSiTiVNbCr target and Cr target, the AlSiTiVNbCr target is connected to the RF power supply, the Cr target is connected to the DC power supply, and the target base distance is 60mm; ×10 -3 After Pa, 60sccm of argon was introduced to keep the pressure in the vacuum chamber at about 0.74Pa, and th...

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Abstract

The invention discloses a gradient transition layer for improving the film-substrate bonding strength of a high-entropy nitride film and a preparation method. The preparation method comprises the following steps: sequentially carrying out ultrasonic cleaning and plasma cleaning on a tool substrate; a metal layer is deposited on the tool base body subjected to plasma cleaning through a magnetron sputtering method; depositing a metal nitride connecting layer on the metal layer; depositing a nitride thin film layer on the metal nitride connecting layer; the metal layer and the metal nitride connecting layer are sequentially deposited between the cutter base body and the nitride thin film layer through the magnetron sputtering method, components in the metal nitride connecting layer change in a continuous gradient mode, the internal stress of the thin film can be relieved, the film-base bonding strength between the nitride thin film layer and the cutter base body is improved, and the service life of the cutter is prolonged. And the service life of the cutter can be prolonged.

Description

technical field [0001] The invention belongs to the technical field of tool surface treatment, and in particular relates to a gradient transition layer and a preparation method for improving the bonding strength of a high-entropy nitride film and film-base. Background technique [0002] With the continuous progress and development of industrial technology, the cutting performance and service life of traditional coated tools can no longer meet the needs of the industry. High-entropy alloy nitride films have attracted extensive attention of researchers due to their high hardness, wear resistance, and good thermal stability. [0003] However, the poor bonding force between the film prepared by the magnetron sputtering technology and the tool substrate has always been the main problem in the preparation of the tool thin film, which seriously affects the service life of the tool. Therefore, it is an urgent problem to be solved in the field of cutting tools to find a method to im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/06C23C14/16C23C14/35
CPCC23C14/35C23C14/16C23C14/0641C23C14/0036C23C14/022
Inventor 邵文婷曹丽娜陈建杨巍李仲硕何佳华卢帅丹
Owner XIAN TECHNOLOGICAL UNIV
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