Rapid detection method, electronic equipment and storage medium for leakage of PCB forming groove
A detection method and technology for forming grooves, which are applied in measurement devices, optical testing flaws/defects, instruments, etc., can solve problems such as increased production costs, low detection efficiency, inability to improve production quality and production efficiency, and achieve high detection accuracy. , the effect of improving production quality and production efficiency
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Embodiment 1
[0055] During the production process of the PCB, regular molding grooves will be formed at one or more positions of the PCB according to the production requirements, which are used for the positioning of the devices on the PCB or the PCB. However, in the production process, due to the breakage of the gong knife or other reasons, the phenomenon of missing gongs occurs from time to time. Therefore, it is necessary to detect whether there is a leakage of gongs on the finished PCB to prevent quality problems and cause user dissatisfaction. However, the production volume of PCBs is huge, and it takes a lot of labor to test a large number of PCBs. The intricate gongs and grooves make the inspectors dazzled, not only the inspection efficiency is low, but also it is prone to false inspections and missed inspections, which increases the production cost but still cannot Improve production quality and production efficiency.
[0056] In order to solve the above problems, the embodiments o...
Embodiment 2
[0081] In order to facilitate understanding, an example of a rapid detection method for PCB molding groove leakage is provided below for illustration. In practical applications, after the photoelectric detection sensor is turned on, the receiving end of the photoelectric detection sensor cannot receive the photoelectric detection sensor. The case of the optical signal emitted by the transmitting end.
[0082] see figure 2 and image 3 , the second embodiment of the rapid detection method for PCB molding groove leakage shown in the embodiment of the present application includes:
[0083] 201. Turn on the photoelectric detection sensor to detect the PCB under inspection. If the receiving end of the photoelectric detection sensor cannot receive the light signal emitted by the transmitting end of the photoelectric detection sensor, determine the PCB under inspection with a suspended distance greater than or equal to the preset exposure height. , at least one PCB under inspectio...
Embodiment 3
[0097] In order to facilitate understanding, an example of a rapid detection method for PCB molding groove leakage is provided below for illustration. In practical applications, the slot layout position and PCB thickness are determined through image analysis. According to the PCB thickness and preset exposure height And the height of the pin body determines the number of target grabs of the PCB to be inspected in each inspection, so as to increase the number of target grabs in each inspection as much as possible under the permitted conditions, so as to improve the inspection efficiency and improve the detection reliability.
[0098] see Figure 4 , Embodiment 3 of the rapid detection method for PCB molding groove leakage shown in the embodiment of the present application includes:
[0099] 301. Shoot a surface image of any PCB to be detected by an imaging device;
[0100] In the embodiment of the present application, the imaging device may be an industrial camera. In practica...
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