Semiconductor packaging structure and manufacturing method thereof

Abstract

The invention provides a semiconductor packaging structure and a manufacturing method thereof. The semiconductor packaging structure comprises a first stacking structure and a second stacking structure which are stacked, the first stacked structure comprises a first dielectric layer, a first power chip, a first conductive connecting element, a first conductive column and a first patterned conductive layer; the second stacked structure comprises a second dielectric layer, a second power chip, a second conductive connecting element, a second conductive column, a second patterned conductive layer and a third patterned conductive layer; a first power wafer and a second power wafer are stacked up and down so as to provide a semiconductor packaging structure in which the first power wafer and the second power wafer can be directly and electrically connected through a circuit structure and related defects of a lead frame can be eliminated. In addition, the invention also provides a manufacturing method of the semiconductor packaging structure.

Description

technical field [0001] The present invention relates to a package structure and a manufacturing method thereof, in particular to a semiconductor package structure and a manufacturing method thereof. Background technique [0002] With the substantial increase in the demand for information and automotive electronics, the package structure of the Quad Flat No-Lead (QFN) package has been widely used because of its better heat dissipation effect, lower impedance value and anti-electromagnetic interference. Become an important semiconductor packaging technology. [0003] In the QFN structure, the copper clip technology is a technology developed to meet high power requirements. The copper sheet is designed in the shape of an arch bridge with a high and low drop. The copper sheet is bonded to the chip by a solder dispenser. It has a small impedance to carry a large current and can withstand deformation caused by thermal stress, so it is suitable for Such as high power components s...

AI Technical Summary

Problems solved by technology

[0007] (1) The package structure uses lead frames and bridging copper sheets, so the height (thickness) of the package cannot be reduced, which limits its application field

[0008] (2) Solder or solder paste contains a relatively high proportion of lead, and lead metal will cause environmental pollution and have a considerable impact on human health

[0009] (3) Each component may be displaced before the high-temperature reflow process at 380 degrees Celsius fixes all components, resulting in a decrease in accuracy

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