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Packaging structure and packaging method

A technology of packaging structure and packaging method, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of high dielectric constant of ceramic materials, complex process, high packaging cost, and achieve simple manufacturing and simplified packaging. The effect of low process and packaging costs

Pending Publication Date: 2022-06-03
SHANGHAI HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ceramic-related process is complex, the packaging cost is high, the early development cycle is long, the design is not flexible, the dielectric constant of the ceramic material is relatively high, and the parasitic parameters of the pin are large

Method used

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  • Packaging structure and packaging method
  • Packaging structure and packaging method
  • Packaging structure and packaging method

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Experimental program
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Effect test

Embodiment Construction

[0048] The embodiment of the present application provides a packaging structure and a packaging method, which simplifies the packaging process, reduces the packaging cost, and improves the packaging reliability.

[0049] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead...

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PUM

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Abstract

The invention discloses a packaging structure and a packaging method, the packaging structure can comprise a packaging substrate, the packaging substrate can be used for bearing a tube core, a printed circuit board can be arranged on the packaging substrate, the printed circuit board comprises a board body and metal pins on the board body, the board body is of an annular structure, the metal pins extend out of the board body in the transverse direction, and the metal pins are arranged on the board body. The metal pins are used for being connected with an external circuit, and the metal pins are also used for being connected with the tube core when the tube core is arranged on the packaging substrate exposed on the board body, that is, the packaging frame and the pins in the embodiment of the invention can be printed circuit boards, and the printed circuit boards comprise the metal pins which can extend out of the board body, so that electrical connection between the tube core and the external circuit is realized; as the printed circuit board is simple to manufacture, the packaging cost is low, and as the packaging frame and the pins form an integrated structure, the packaging process is simplified.

Description

technical field [0001] The present application relates to the technical field of packaging, and in particular to a packaging structure and a packaging method. Background technique [0002] In actual operation, it is necessary to package the die to form a complete device. The functions of the packaging structure for packaging the die include: 1) to realize electrical connection, that is, to connect the internal circuit of the die to the external circuit. It is mainly realized by pins; 2) Provide physical protection for the die to avoid damage caused by mechanical contact during the turnover, circuit assembly, and actual work of the device; 3) As a carrier of electrical conduction and heat conduction, and ensure a better matching of thermal expansion coefficients, Buffer the influence of thermal stress, expand the applicable temperature range of the device, and enhance the reliability of the device. Specifically, the package structure needs to include a substrate, a package f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/50
CPCH01L23/49541H01L21/50H01L2224/48091H01L23/047H05K2201/10166H05K1/021H05K2201/1034H01L23/552H01L23/66H01L24/32H01L24/83H01L24/29H01L2924/00014H01L23/4952H01L23/04H05K1/181H01L2224/48175H01L21/52H01L23/053H01L23/13H01L23/49811H01L23/49838H01L24/48H01L24/85H01L2224/85
Inventor 林燕海黄明利张小敏黄安杨冠翘
Owner SHANGHAI HUAWEI TECH CO LTD