Wire anti-drop welding device for electronic component processing
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANTONG SANXI ELECTRONICS CO LTD
- Publication Date
- 2022-06-24
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of electronic component processing, in particular to a wire de-soldering device for electronic component processing. Background technique
[0002] In the actual processing of electronic components, such as lamp processing, etc., the conductive connection of the circuit is an important step, and it is often the direct contact between two conductive components, because the processing quality of electronic components is involved. It is particularly important to have a good wire anti-soldering device for electronic component processing with zigzag protruding welding heads.
[0003] However, as for the current traditional electronic component welding device, the cost is high, the technical requirements for the operator are high, the automatic soldering cannot be assisted, the welding efficiency is low, the auxiliary floating cleaning and smoke filtration cannot be realized, the welding quality is low, and the def...