Welding device of electronic elements on integrated circuit board

A technology for integrated circuit boards and electronic components, which is applied in the field of welding devices, can solve the problems of unstable wiring, low efficiency, and difficulty in finding weak solder joints, and achieves the effect of improving welding efficiency and improving welding accuracy.

Inactive Publication Date: 2017-01-04
DONGGUAN LIANZHOU INTPROP OPERATION MANAGEMENT CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the traditional production process, each electronic component is manually welded on the integrated circuit board. In the process of welding each electronic component on the integrated circuit bo

Method used

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  • Welding device of electronic elements on integrated circuit board
  • Welding device of electronic elements on integrated circuit board
  • Welding device of electronic elements on integrated circuit board

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Embodiment Construction

[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] Such as Figure 1-4 As shown, the welding device for electronic components on the integrated circuit board includes a base 10, the upper part of the base 10 is fixedly provided with a positioning and clamping mechanism 1, the side of the positioning and clamping mechanism 1 is provided with a welding mechanism 2, and the upper part of the base 10 is also provided with a control box. The box is electrically connected with the positioning and clamping mechanism 1 and the welding mechanism 2; the positioning and clamping mechanism 1 includes two support frames that are oppositely arranged and have the same structure. 111 and the vertical plate 112 are connected with a reinforcing plate 113, and the inner side of the vertical plate ...

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Abstract

The invention discloses a welding device of electronic elements on an integrated circuit board. The welding device comprises a base, a positioning clamping mechanism is fixedly arranged on the upper portion of the base, a welding mechanism is arranged on the side face of the positioning clamping mechanism, a control box is arranged on the upper portion of the base, and is electrically connected with the positioning clamping mechanism and the welding mechanism, and the positioning clamping mechanism comprises two opposite supporting frames of the same structure; each supporting frame comprises a bottom plate, a vertical plate is fixedly connected to the upper portion of each bottom plate, a reinforcing plate is arranged between each bottom plate and the corresponding vertical plate, a lifting sliding rail is arranged on the inner side of each vertical plate, the end of each lifting sliding rail is in an isosceles trapezoid, and racks are arranged on the two outer side inclined sides. The welding mechanism is adopted to weld the electronic elements, the welding efficiency is improved, the welding precision is improved, meanwhile, a CCD camera on the welding mechanism can detect the welded integrated circuit board, and whether the welding is good or not can be distinguished.

Description

[0001] Technical field: [0002] The invention relates to the technical field of integrated circuit packaging, in particular to a welding device for electronic components on an integrated circuit board. [0003] Background technique: [0004] An integrated circuit is a microelectronic device or component that uses a certain process to combine the required components in a circuit crystal body tube , resistance , capacitance with inductance and other components and wiring interconnection together, made in a small piece or a few small pieces semiconductor chip or medium On the substrate, and then encapsulated in a tube shell, it becomes a microstructure with the required circuit function; all the components in it have been integrated in the structure, making the electronic components towards miniaturization, low power consumption, intelligence and high reliability. A big step forward. [0005] In the traditional production process, each electronic component is manuall...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K3/00H05K3/34
CPCB23K3/08B23K3/00B23K3/087B23K2101/42H05K3/34
Inventor 李风浪李舒歆
Owner DONGGUAN LIANZHOU INTPROP OPERATION MANAGEMENT CO LTD
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