Polyamide composition and application thereof

A polyamide composition and polyamide technology, applied in the field of LAP, can solve the problems of line profile corrosion, large residual amount, influence on coating adhesion, etc., and achieve the effect of improving product yield, uniform surface lines, and improving overflow plating.
CN114685980APending Publication Date: 2022-07-01ZHUHAI WANTONG SPECIAL ENG PLASTICS CO LTD +1
6 Cites 1 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ZHUHAI WANTONG SPECIAL ENG PLASTICS CO LTD
Publication Date
2022-07-01

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a polyamide composition and application thereof, and belongs to the technical field of LAP. The polyamide composition comprises the following components in parts by weight: 50-90 parts of polyamide, 0.5-2 parts of a laser initiator, 1-5 parts of a laser protective agent and 5-30 parts of flaky filler, the laser initiator is a solid solution formed by a metal oxide solvent and a metal oxide solute; the laser protective agent is an isocyanate compound. The polyamide composition can effectively solve the problems of overflow plating, skip plating and the like in the LAP technology laser etching chemical plating process, and a high-quality three-dimensional circuit with a uniform surface circuit is obtained.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of LAP, and in particular relates to a polyamide composition and use thereof. Background technique

[0002] Laser Activating Plating (LAP) is a technology that uses laser to induce selective metal plating on ordinary plastic substrates. It can produce electrical appliances and interconnected devices with electrical functions on any molding surface. Mobile phones, wearable devices, LEDs and other fields have broad application prospects. However, the traditional Laser Direct Structuring (LDS) technology requires special LDS laser modified materials, which restricts the development space of its market application, resulting in its lack of cost advantages compared with traditional FPC and other technologies. difficult to promote on a large scale. The three-dimensional properties of LAP are consistent with LDS, but LAP does not require specific LDS laser-induced materials, and the material cost is saved by 50% ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More