Method for improving overflow plating and adhesive force performance of chemical plating layer in LDS process

Abstract

The invention provides a method for improving overflow plating and adhesion performance of a chemical plating layer in an LDS process. The method comprises the following steps of: performing laser activation on a substrate by using an LDS technology to activate a plurality of first conductive regions; scanning the boundaries of the plurality of first conductive regions by adopting laser beams to obtain second conductive regions, and the energy of the laser beams adopted in the second laser processing being lower than that of the laser beams adopted in the first laser processing; and metallizing the plurality of second conductive regions to form circuits, the distance between the adjacent circuits being 0.1-0.3 mm. According to the invention, a laser treatment process is added on the basisof the existing LDS process. The substrate is firstly subjected to laser activation by adopting the laser with higher power, and then the boundary of the activation area is subjected to laser activation by adopting the laser with lower power, so that when the method is used for processing the circuit board with the small-spacing circuit, the risk of overflow plating of the chemical plating layer can be reduced, and the adhesive force of the chemical plating layer can be ensured to pass a hundred-grid test.

Description

technical field [0001] The invention belongs to the technical field of LDS, in particular to a method for improving the overflow plating and adhesion performance of the electroless coating in the LDS process. Background technique [0002] Laser direct structuring (LDS) technology uses a computer to control the movement of the laser according to the trajectory of the conductive pattern, projects the laser onto the plastic device, and activates the circuit pattern within a few seconds. [0003] The current conventional LDS technical process is as follows: see figure 1 As shown, the LDS substrate is first activated by laser, the activation path is shown by the arrow in the figure, and then metallization is performed on the activated area to form a circuit. However, in order to increase the strength, the current plastic materials usually contain glass fiber components. When the laser is irradiated with high intensity, the glass fiber often protrudes, and the glass fiber is very...

AI Technical Summary

Problems solved by technology

However, in order to increase the strength, the current plastic materials usually contain glass fiber components. When the laser is irradiated with high intensity, the glass fiber often protrudes, and the glass fiber is very easy to be plated, especially for small-pitch circuits. The laser activates the plastic material, which is easy to cause a short circuit in the adjacent circuit, such as figure 2 As shown, the chemical plating layer of adjacent lines is connected; in order to avoid the situation of overflow plating, laser activation of plastic materials is performed with low-power laser, which will cause the metal particles in the LDS substrate to not be fully activated, which will lead to poor adhesion of the chemical plating layer. Not enough, the 100 grid test cannot pass

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