Chip packaging multi-parameter detection equipment and detection method

A technology for testing equipment and chip packaging, applied in measurement devices, instruments, etc., can solve the problems of not ensuring the corresponding changes in the internal parameters of the chip, increasing the testing cost and testing period, and increasing the testing error, so as to shorten the testing period and reduce the Detection cost and the effect of reducing detection errors

Active Publication Date: 2022-07-01
上海聚跃检测技术有限公司
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  • Claims
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Problems solved by technology

However, the existing detection equipment can only detect a single environmental external parameter. When different environmental external parameters are required as target parameters, it is often necessary to replace different detection equipment for detection, which increases the detection cost and detection cycle.
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  • Chip packaging multi-parameter detection equipment and detection method
  • Chip packaging multi-parameter detection equipment and detection method
  • Chip packaging multi-parameter detection equipment and detection method

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Embodiment Construction

[0026] In order to make those skilled in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0027] In the first aspect, the embodiments of the present application provide a chip package multi-parameter testing device 100, including a base; a testing table 1, the testing table 1 is arranged on the base, the testing table 1 is provided with a testing position 8, and the testing position 8 is used for placing the chip, The chip is elect...

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Abstract

The invention provides chip packaging multi-parameter detection equipment, which comprises a detection table, and is characterized in that the detection table is provided with a detection position, and the detection position is used for placing a chip; the pressure detection assembly comprises a pressure regulator, a pressure cover and a pressure sensor; the pressure sensor is arranged in the accommodating cavity and is used for detecting a pressure value in the accommodating cavity; the temperature detection assembly comprises a heating device and a temperature sensor, and the temperature sensor is arranged in the containing cavity and used for detecting the temperature value in the containing cavity; the humidity detection assembly comprises a humidifier and a humidity sensor, and the humidity sensor is arranged in the containing cavity and used for detecting the humidity value in the containing cavity; the central control unit is arranged on the base. According to the method, the chip internal parameters of the chip are tested under the condition of different environment external parameters, so that whether the chip meets the use requirement or not is judged, the detection cost is reduced, the detection period is shortened, and the detection error is reduced.

Description

technical field [0001] The present application relates to the technical field of chip packaging, and in particular to a multi-parameter detection device and detection method for chip packaging. Background technique [0002] With the progress of society, the chip design is constantly changing with the requirements of higher speed, higher performance and higher integration, and the packaging of the chip is particularly important. When the chip is packaged, it is necessary to perform parameter testing on randomly selected sample chips. The testing includes Internal parameters of the chip and external parameters of the environment. The internal parameters of the chip include leakage current, signal-to-noise ratio, intermodulation distortion, jitter, phase noise, etc. The external parameters of the environment mainly include temperature, pressure, humidity, etc., to detect whether the chip meets the requirements for use. [0003] When changing the external parameters of the envir...

Claims

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Application Information

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IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 陈学林刘振鑫段新荣
Owner 上海聚跃检测技术有限公司
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