Chip packaging multi-parameter detection equipment and detection method
A technology for testing equipment and chip packaging, applied in measurement devices, instruments, etc., can solve the problems of not ensuring the corresponding changes in the internal parameters of the chip, increasing the testing cost and testing period, and increasing the testing error, so as to shorten the testing period and reduce the Detection cost and the effect of reducing detection errors
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[0026] In order to make those skilled in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
[0027] In the first aspect, the embodiments of the present application provide a chip package multi-parameter testing device 100, including a base; a testing table 1, the testing table 1 is arranged on the base, the testing table 1 is provided with a testing position 8, and the testing position 8 is used for placing the chip, The chip is elect...
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