Semiconductor circuit
A semiconductor and circuit technology, applied in the field of semiconductor circuit applications, can solve problems such as failure of driver chips
Pending Publication Date: 2022-07-12
广东汇芯半导体有限公司
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Problems solved by technology
[0003] The technical problem to be solved in the present invention is to solve the problem that the existing semiconductor circuit driver chip is prone to failure due to the introduction of high voltage
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[0031] It should be noted that the embodiments of the present invention and the features of the embodiments may be combined with each other under the condition that the structures or functions do not conflict. The present invention will be described in detail below based on examples.
[0032] The semiconductor circuit mentioned in the present invention is a circuit module that integrates a power switching device and a high-voltage drive circuit, and is sealed and packaged on the outside. It is widely used in the field of power electronics, such as frequency converters for driving motors, Various inverter voltage, frequency conversion speed regulation, metallurgical machinery, electric traction, frequency conversion household appliances and other fields. The semiconductor circuit here has various other names, such as Modular Intelligent Power System (MIPS), Intelligent Power Module (IPM), or hybrid integrated circuits, power semiconductor modules, power Module, etc. name.
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The invention relates to a semiconductor circuit which comprises an inverter circuit, a driving circuit and an optical coupler isolation circuit, the inverter circuit comprises six switching tubes of three upper and lower bridge arms, the driving circuit comprises a driving chip, and the driving chip comprises three high-voltage driving output ends and three low-voltage driving output ends; the three paths of high-voltage driving output ends are respectively connected with driving ends of three switching tubes of the three paths of upper bridge arms, the coupled isolation circuit comprises three paths of input ends and three paths of output ends, the three paths of input ends are respectively connected with the three paths of low-voltage driving output ends, and the three paths of output ends are respectively connected with driving ends of three switching tubes of the three paths of lower bridge arms. The optical coupling isolation circuit is arranged between the three low-voltage driving output ends of the driving chip and the three lower bridge arm switch tubes of the inverter circuit, so that isolation of driving signal transmission channels between the three low-voltage driving output ends of the driving chip and the three lower bridge arm switch tubes is realized, and the working reliability of the semiconductor circuit is improved.
Description
technical field [0001] The invention relates to a semiconductor circuit and belongs to the technical field of semiconductor circuit application. Background technique [0002] Semiconductor circuit is a power drive product that combines power electronics and integrated circuit technology. The semiconductor circuit integrates a 6-channel inverter circuit and a drive circuit. The inverter circuit works in a high-voltage environment. If the lower-arm switch tube fails, the high voltage is easily introduced into the driver chip through these switches, resulting in the driver chip. Burn out. SUMMARY OF THE INVENTION [0003] The technical problem to be solved by the present invention is to solve the problem that the existing semiconductor circuit driver chip is easily failed due to the introduction of high voltage. [0004] Specifically, the present invention discloses a semiconductor circuit, comprising: [0005] Inverter circuit, the inverter circuit includes six switch tub...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L25/16H01L23/367H01L23/495H02M1/092H02M7/00
CPCH01L25/16H01L23/49548H01L23/49565H01L23/49575H01L23/49568H01L23/3672H02M1/092H02M7/003H01L2224/48137H01L2924/181H01L2224/48227H01L2924/00012
Inventor 冯宇翔左安超张土明谢荣才黄浩
Owner 广东汇芯半导体有限公司