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Mortar cylinder and silicon wafer cutting system

A mortar and liquid storage chamber technology, applied in separation methods, foam dispersion/prevention, cleaning methods and utensils, etc., can solve the problems of silicon wafer cutting and disconnection, mortar turbidity, damage to cutting machines, etc.

Pending Publication Date: 2022-07-15
广东高景太阳能科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing mortar cylinder, on the one hand, the mortar falls from the feed port of the mortar cylinder, and directly impacts the wall surface of the mortar cylinder to cause the turbidity of the mortar; The foam will also leave silicon powder particles in the mortar tank where the mortar cannot be submerged for a long time, such as the top of the mortar tank or the higher part of the side wall, and these silicon powder particles will also fall into the mortar after solidification; On the one hand, the silicon powder particles in the mortar are deposited at the lower corner of the discharge port of the mortar cylinder, and the suction pump pumps liquid from the discharge port
[0004] The above-mentioned silicon powder particles are deposited below the discharge port or the silicon powder particles on the inner wall of the mortar cylinder fall into the mortar, or the foam of silicon powder particles floats on the surface, which will make the suction pump suck out the silicon powder particles during the process of sucking the mortar. , the filtered mortar still contains a large amount of silicon powder particles, so that when cutting silicon wafers, the silicon powder particles in the mortar damage the cutting machine, and also cause the silicon wafers to be cut off

Method used

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  • Mortar cylinder and silicon wafer cutting system
  • Mortar cylinder and silicon wafer cutting system
  • Mortar cylinder and silicon wafer cutting system

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Embodiment Construction

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] Hereinafter, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first", "second" may expressly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, unless otherwise specified, "...

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Abstract

The invention discloses a mortar cylinder and a silicon wafer cutting system. The mortar cylinder comprises a mortar cylinder body, a first flow guide channel, a second flow guide channel, a first filter screen and a second filter screen, the mortar cylinder body is provided with a first liquid storage cavity, a second liquid storage cavity and a third liquid storage cavity which are sequentially arranged, the first liquid storage cavity is provided with a feeding port, and the third liquid storage cavity is provided with a discharging port; the first flow guide channel is arranged between the first liquid storage cavity and the second liquid storage cavity; the second diversion channel is arranged between the second liquid storage cavity and the third liquid storage cavity, and the distance between the bottom of the second diversion channel and the bottom of the second liquid storage cavity is smaller than that between the bottom of the first diversion channel and the bottom of the second liquid storage cavity; the first filter screen is arranged in the first flow guide channel, and the second filter screen is arranged in the second flow guide channel. The silicon wafer cutting system comprises the mortar cylinder. The mortar cylinder filters mortar layer by layer, the quality of the filtered mortar is improved, the lubricating performance, the cooling performance and the like of mortar liquid are enhanced, a cutting machine is prevented from being damaged, the line breaking rate in the silicon wafer cutting process is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cutting, in particular to a mortar tank and a silicon wafer cutting system. Background technique [0002] The silicon wafer is cut by a wire saw cutting machine, and impurities such as silicon powder particles produced by cutting the silicon wafer will be mixed in the cutting liquid to form mortar; in order to avoid waste, a mortar tank is generally connected outside the cutting machine to precipitate and filter the mortar. The mortar is used as cutting fluid. [0003] However, in the existing mortar tank, on the one hand, the mortar falls from the feeding port of the mortar tank and directly impacts the wall surface of the mortar tank, resulting in turbidity of the mortar; on the other hand, the mortar impacts the wall surface of the mortar tank to generate foam, and silicon floats on the surface of the foam Powder particles and foam will also leave silicon powder particles in the mortar t...

Claims

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Application Information

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IPC IPC(8): B01D29/03B01D29/56B01D29/60B01D29/94B08B9/093B01D19/02
CPCB01D29/03B01D29/56B01D29/94B01D29/60B08B9/093B01D19/02
Inventor 付明全徐志群孙彬杨振忠毕喜行汤琦
Owner 广东高景太阳能科技有限公司