Online fine adjustment mechanism for high-density integrated circuit lead frame coiling disc

Abstract

The invention relates to the technical field of feeding equipment, in particular to a high-density integrated circuit lead frame winding disc online fine adjustment mechanism which comprises a supporting shaft used for bearing a winding disc, the supporting shaft is provided with a limiting plate and a clamping piece in a separated mode, the supporting shaft is detachably sleeved with the clamping piece, and the limiting plate can move in the axial direction of the supporting shaft to be limited in the circumferential direction. A rotatable adjusting rod penetrates through the supporting shaft and is in threaded connection with the limiting plate, and the end of the adjusting rod penetrates out of the supporting shaft. When the distance between the winding disc and the limiting plate needs to be adjusted or after winding discs of different sizes and specifications are replaced, the adjusting rod is rotated through external force operation to drive the limiting plate to move in the axial direction of the supporting shaft, the side edge of a material belt on the winding disc is prevented from scraping the limiting plate, the problems of dust and deformation are avoided, adjustment is convenient and easy, the adjusting rod penetrates out of the supporting shaft, and the adjusting rod is convenient to adjust. And the operation space is larger. In practice, the position of the clamping piece on the supporting shaft can be adjusted when necessary, and adjustment in a larger range is met.

Description

technical field [0001] The invention relates to the technical field of feeding equipment, in particular to an on-line fine-tuning mechanism for a high-density integrated circuit lead frame reel. Background technique [0002] The high-density integrated circuit lead frame is an essential component in the manufacture of integrated circuit semiconductor components. In order to meet the needs of manufacturing integrated circuit semiconductor components, the surface local area of ​​the integrated circuit lead frame needs to be electroplated with metallic silver or nickel palladium gold. Electroplating refers to a surface processing method in which the base metal to be plated is used as the cathode in a salt solution containing pre-plated metal, and the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis to form a coating. , During electroplating, the plated metal or other insoluble material is used as the an...

AI Technical Summary

Problems solved by technology

Existing problems: There are differences in the width of multiple rolls of frame material tape. If the position of the material tape on the support shaft remains unchanged, due to the different widths of the rewinding and unwinding coil materials, when the coil material is too wide or the coil material jumps, the lead frame material tape The side of the belt will rub against the clamping tray, resulting in dust on the scraping edge of the material belt, or quality problems such as side deformation, which will affect the processing efficiency

Therefore, it is necessary to adjust the position of the reel according to the width of the material tape, or when switching reels of different widths, so that the material tape can walk along the ideal trajectory. However, the existing support shafts are difficult to adjust, or the adjustment method is too complicated, giving Inconvenient to operate

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