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Graphene metal-based composite material and preparation method thereof

A composite material and graphene technology, applied in the direction of metal processing equipment, non-metallic elements, chemical instruments and methods, etc., can solve the problems of powerless heat dissipation density electronic devices, low heat dissipation efficiency, etc., and achieve the effect of enhancing heat transfer efficiency

Pending Publication Date: 2022-07-15
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Electronic devices need to consider the fragility of the connectors at the key heat dissipation parts. Usually, heat transfer materials with low thermal conductivity such as epoxy resin conductive adhesives are used. Although such materials are simple and easy to obtain, they can ensure a certain degree of connection. Reliability, but the heat dissipation efficiency is very low, often below 10W / m K, which is very weak for some electronic devices with high heat dissipation density

Method used

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  • Graphene metal-based composite material and preparation method thereof
  • Graphene metal-based composite material and preparation method thereof
  • Graphene metal-based composite material and preparation method thereof

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Embodiment 1

[0033] The present embodiment provides a preparation method of a graphene metal-based composite material, specifically a preparation method of a molecular-level treated graphene-copper-based composite material, comprising the following steps:

[0034] Adding graphene to CuSO 4 In the solution, ultrasonically vibrate for 10min to disperse evenly, then insert the positive and negative electrodes into the mixed solution, control the voltage of the positive and negative electrodes, reverse the electrodes every 2min, and reverse 6 times, and finally scrape the mixture on the electrodes to obtain metallized graphite alkene, its SEM microstructure see figure 1 .

[0035] The metallized graphene, nano-copper powder and organic solvent are mixed to obtain nano-copper paste, which is finally sintered in a hot pressing sintering furnace, the sintering temperature is 300° C. and the pressure is 5 MPa to obtain the graphene metallized composite material.

[0036] CuSO in this example 4 ...

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Abstract

The invention discloses a graphene metal-based composite material and a preparation method, and relates to the technical field of mechano-electronics. According to the method, surface metallization is carried out on graphene by adopting a molecular-level engineering method; and preparing the metallized graphene and the metallized metal nanoparticles into paste, and sintering to obtain the graphene metal-based composite material. The metal wettability of the graphene can be changed after the graphene is metalized, the problem that the binding force of the graphene and the metal is poor is solved, metalized particles on the surface of the graphene become a heat transfer bridge of the graphene and the metal, and the heat transfer efficiency of the composite material is greatly enhanced. According to the preparation method of the graphene metal-based composite material, the composite material with high heat conductivity can be produced under low sintering pressure and mechanical pressure.

Description

technical field [0001] The invention relates to the technical field of mechatronics, in particular to a graphene metal matrix composite material and a preparation method. Background technique [0002] Electronic devices need to consider the fragility of connectors at key heat dissipation parts. Usually, heat transfer materials with low thermal conductivity such as epoxy resin conductive adhesives are used. Although such materials are simple and easy to obtain, they can ensure a certain connection. Reliability, but the heat dissipation efficiency is very low, often below 10W / m·K, which is very weak for some electronic devices with high heat dissipation density. The quality of the heat dissipation effect directly affects the performance and service life of the device. How to improve the heat dissipation at the connection of the electronic device, prolong the service life of the electronic device, and improve the performance are the key problems that need to be solved urgently...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C1/10C22C9/00B22F3/14B22F1/10B22F7/08B22F1/18C01B32/194
CPCC22C1/05C22C9/00B22F3/14B22F7/064C01B32/194
Inventor 张凯张鑫曾少宽钟岸辉
Owner GUANGDONG UNIV OF TECH
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