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Semiconductor packaging structure

A packaging structure and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of poor heat dissipation, less projected area resources, and unsatisfactory problems, so as to improve performance and improve heat dissipation efficiency effect

Pending Publication Date: 2022-07-19
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, while existing semiconductor packaging structures are generally adequate, they are not satisfactory in every respect
For example, stacked package structures share less projected area resources than side-by-side package structures, which makes heat dissipation worse

Method used

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  • Semiconductor packaging structure
  • Semiconductor packaging structure
  • Semiconductor packaging structure

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Embodiment Construction

[0028] In the following detailed description of embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which there are shown, by way of illustration, specific preferred embodiments in which the invention may be practiced . These embodiments are described in sufficient detail to enable those skilled in the art to practice them, and it is to be understood that other embodiments may be utilized, and mechanical, structural and procedural changes. this invention. Therefore, the following detailed description should not be construed as limiting, and the scope of embodiments of the present invention is limited only by the appended claims.

[0029] It will be understood that although the terms "first," "second," "third," "primary," "secondary," etc. may be used herein to describe various elements, components, regions, layers and / or sections , but these elements, components, regions, layers and / or sections should not be limited...

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Abstract

The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a first redistribution layer; a semiconductor die disposed over the first redistribution layer; a heat sink disposed over the semiconductor die; and a molding material surrounding the semiconductor die and the heat sink. The semiconductor packaging structure comprises the heat radiator adjacent to the heat source, so that the heat radiation efficiency is improved, and the performance of the semiconductor packaging structure is further improved. The embodiment of the invention is particularly suitable for heat dissipation in stack packaging, the heat dissipation efficiency is low due to the fact that the thickness of the stack packaging is large, and the heat dissipation efficiency can be remarkably improved by adopting the structure of the embodiment of the invention.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to a semiconductor packaging structure. Background technique [0002] Package-on-package (PoP) technology is becoming more and more popular as the demand for smaller devices with more functions increases. PoP technology stacks two or more package structures vertically. Through the stacked package structure, the area of ​​the motherboard occupied by the motherboard (motherboard) can be reduced, thereby increasing the battery capacity of the mobile phone. [0003] However, while existing semiconductor package structures are generally adequate, they are not satisfactory in every respect. For example, the stacked package structure shares less projected area resources than the side-by-side package structures, which results in poorer heat dissipation. Heat dissipation is a critical issue that needs to be addressed as it affects the performance of semiconductor packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/64H01L25/18
CPCH01L23/367H01L23/3736H01L23/3738H01L23/642H01L25/18H01L23/3128H01L2924/181H01L2924/15311H01L2224/48227H01L2224/48091H01L2224/18H01L23/49811H01L23/5385H01L23/5383H01L23/5384H01L23/36H01L23/13H01L2924/00012H01L2924/00014H01L23/49822H01L23/3107
Inventor 郭哲宏刘兴治许家豪
Owner MEDIATEK INC
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