Heat dissipation assembly based on big data device

Abstract

The invention discloses a heat dissipation assembly based on a big data device, and particularly relates to the field of heat dissipation equipment, the heat dissipation assembly comprises a water cooling auxiliary mechanism, the water cooling auxiliary mechanism comprises a connecting port frame, the outer side of the connecting port frame is rotatably connected with a limiting sliding sleeve, and a condensation return pipe is inserted into the outer side of the limiting sliding sleeve; an end joint block is arranged on one side of the condensation backflow pipe, a limiting clamping bent plate is arranged on the outer surface of the condensation backflow pipe in an attached mode, the end joint block at the upper end is connected with a water pump, water of the water pump is conveyed back and forth in the condensation backflow pipe and a water pipe, the end joint block at the lower portion pumps out the water, and circulation is formed. And hot air conducted in the air cooling heat dissipation mechanism can pass through a condensation backflow frame, and heat can be eliminated through circulating water flow in a backflow pipe, so that water cooling is not in contact with the electronic equipment, water is prevented from entering the device, heat of the big data device is well conducted, and the heat dissipation efficiency is improved.

Description

technical field [0001] The present invention relates to the technical field of heat dissipation equipment, and more particularly, the present invention relates to a heat dissipation component based on a big data device. Background technique [0002] Big data refers to the amount of data involved that is too large to be captured, managed, processed, and organized within a reasonable time through mainstream software tools to help companies make more positive business decisions. Data will use cloud computers, and cloud computers have broad application prospects, which can meet the requirements of high-performance, low-cost, high reliability and high scalability proposed by users in big data industries such as finance, telecommunications, public security, transportation, health, radio and television. It will also promote the wide application of information technology in big data application fields such as the Internet of Things, smart cities, smart grids, smart transportation, s...

AI Technical Summary

Problems solved by technology

[0003] However, at present, big data devices use cloud computers to complete the data exchange. Compared with traditional computers, in order to protect electronic components such as CPU, the computer will be equipped with cooling components such as water cooling and air cooling, which will affect computing power and processing efficiency. For higher cloud computers, the heat dissipation efficiency of commonly used heat dissipation components is low, and the traditional air cooling will make a lot of noise, while the water cooling will contact the electronic components, and if the water cooling tube is damaged, the electronic components will be damaged by water ingress situation occurs, therefore, we propose a heat dissipation component based on a big data device

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