Novel smart card non-contact module packaging process

Abstract

The invention relates to the technical field of electronic packaging processes, in particular to a novel intelligent card non-contact module packaging process which comprises a lead frame chip and thermocuring epoxy resin water between a bonding chip and a lead frame chip bearing table, and the thickness of a glue layer is directly controlled by the diameter of spacer particles in the glue; the diameter of a conventionally used spacer particle is 10-15 [mu] m, and the spacer particle with the diameter of 40-45 [mu] m replaces the conventionally used spacer particle, so that the thickness of the adhesive layer can be increased by 10-20 [mu] m. According to the novel intelligent card non-contact module packaging technology, through the new technical scheme, the final product batch qualification rate can reach 99.9% or above, the cost can be reduced by 50,000 yuan when one million of products are processed, packaging of a super-large chip non-contact intelligent card module is achieved by applying newly researched and developed raw materials and changing the existing processing technology, and the product quality is improved. Optimal production with low cost is achieved, and the product percent of pass is improved to a certain extent on the basis of the conventional percent of pass.

Description

technical field [0001] The invention relates to the technical field of electronic packaging technology, in particular to a novel smart card non-contact module packaging technology. Background technique [0002] In the existing smart card contactless module package, a die between 2.5mm*2.5mm-1mm*1mm is fixed on a chip pad of a lead frame by using a heat-curing epoxy resin. The fusion wire between the gold wire and the silver plating of the lead frame is achieved using ultrasonic, heat and physical shock using a forward standard welding method. The chip and gold wire are wrapped by plastic sealing and heat curing for protection. The die-cutting die separates the modules on the lead frame, and then conducts various electrical performance tests for each packaged module separately, so that the qualified rate of the final packaged product is stabilized at over 99.8%. [0003] Existing packaging methods are aimed at larger-sized chips (such as 3.5mm*3.5mm), which are prone to chi...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a new smart card non-contact module packaging process, which has the advantages of improving the pass rate and reducing costs, and solves the problem of low final pass rate of products and improves the pass rate of final products.

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