Multi-path low-voltage driving circuit board etching device for light beam deflection

Abstract

The invention relates to the technical field of electronic component production, in particular to a multipath low-voltage driving circuit board etching device for light beam deflection, which can automatically etch, clean and dry a circuit board, save manpower and material resources and improve the etching efficiency. Comprising a bottom plate, a U-shaped pool is arranged on the bottom plate, and the U-shaped pool is sequentially divided into an etching tank, a cleaning tank and a drying tank; two groups of vertical plates are symmetrically and fixedly arranged at the hollow part of the U-shaped pool, and a sliding rail is fixedly mounted on each group of vertical plates; the mounting plate is installed on the two sets of sliding rails in a sliding mode through sliding blocks, an adjusting mechanism is installed on the mounting plate, a clamp is arranged on the adjusting mechanism, and the adjusting mechanism is used for controlling the clamp to go in and out of the U-shaped pool; and a driving device is arranged between the two groups of vertical plates and is used for driving the mounting plate to reciprocate along the sliding rails.

Description

technical field [0001] The invention relates to the technical field of electronic component production, in particular to a multi-channel low-voltage drive circuit board etching device for beam deflection. Background technique [0002] The all-solid-state laser radar based on fiber array mainly realizes the two-dimensional deflection of the beam by modulating the wavelength and phase of the laser; this will cause great pressure on the development of the laser and limit the application development of the all-solid-state laser radar; therefore, it is necessary to control the laser wavelength And electronic components such as phase chips are integrated on the circuit board; [0003] The integrated circuit board needs to be etched, cleaned and dried during the production process. In the existing production process, the three processes operate independently. During this period, the board needs to be loaded and unloaded many times. The automation degree is low, which affects the et...

AI Technical Summary

Problems solved by technology

[0002] The all-solid-state laser radar based on the fiber array mainly realizes the two-dimensional deflection of the beam by modulating the wavelength and phase of the laser; this will cause huge pressure on the development of the laser and limit the application and development of the all-solid-state laser radar; therefore, it is necessary to control the wavelength of the laser Electronic components such as chips and phases are integrated on the circuit board;

[0003] The integrated circuit board needs to be etched, cleaned and dried in the production process. In the existing production process, the three processes operate independently. During this period, the board needs to be loaded and unloaded many times. The degree of automation is low, which affects the etching efficiency.

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