Electroplating conductive device and electroplating production line
A technology of conductive device and conductive plate, applied in the direction of electrolysis components, electrolysis process, etc., can solve the problems of low qualified rate of electroplating finished products, electric shock of plating layer, etc. Effect
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[0033] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention. , not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0034] In the description of the embodiments of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" "," "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of desc...
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