Silver paste, method for producing same, and method for producing bonded body

A silver paste, volume technology, applied in the direction of metal/alloy conductor, cable/conductor manufacturing, semiconductor/solid-state device manufacturing, etc.

Pending Publication Date: 2022-08-02
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when electronic components such as chip components are bonded using the silver pastes disclosed in Patent Documents 1 and 2 without forming a metallization layer, it is difficult to bond the electronic components to copper or copper alloy components with high strength.

Method used

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  • Silver paste, method for producing same, and method for producing bonded body
  • Silver paste, method for producing same, and method for producing bonded body
  • Silver paste, method for producing same, and method for producing bonded body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] In order to make the silver paste 100 mass %, mixed solution 1 (24.00 mass %), No. 1 silver powder (75.00 mass %), and 1,2,4-butanetriol (D1) which is a high dielectric constant alcohol (1.00 mass %) After mixing, it stirred with a planetary mixer, and further kneaded with a three-roll mill. Thus, a silver paste was obtained. This silver paste was taken as Example 1.

Embodiment 2～21 and comparative example 1～10

[0106] Each mixed solution of 31 kinds of silver pastes of Examples 2 to 21 and Comparative Examples 1 to 10 was prepared using the fatty acid silver, aliphatic amine and solvent shown in Table 1 and Table 2, and was shown in Table 4 and Table 5. The proportion of silver powder, mixed solution and high dielectric constant alcohol were prepared respectively. A silver paste was prepared in the same manner as in Example 1, except for the preparation of the silver powder, the mixed solution, and the high-dielectric-constant alcohol shown in Tables 4 and 5. However, Comparative Examples 2 and 4 did not become pastes for the reasons described later. In Examples 5, 6, 11, 12, 18 and 19, two high dielectric constant alcohols were used.

[0107] In the column of the type of mixed solutions in Tables 4 and 5, the mixed solutions used in Examples 1 to 21 and Comparative Examples 1 to 10 were selected from "mixed solutions 1 to 15" or "mixed solutions 20 to 22". any representation. In ...

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Abstract

The silver paste is used to form a silver paste layer by being directly applied to the surface of a copper or copper alloy member, and contains a silver powder, a silver fatty acid, an aliphatic amine, a high dielectric constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. It is preferable that the content of the high-dielectric-constant alcohol is 0.01-5 mass% when the silver paste is taken as 100 mass%.

Description

technical field [0001] The present invention relates to a silver paste for bonding electronic components, a method for producing the silver paste, and a method for producing a bonded body using the silver paste. [0002] This application claims priority based on Patent Application No. 2019-230645 filed in Japan on December 20, 2019 and Patent Application No. 2020-204337 filed in Japan on December 9, 2020, the contents of which are incorporated herein by reference. Background technique [0003] Conventionally, in order to use silver paste to bond and fix (die-bond) electronic components such as semiconductor elements such as high-power LED elements and power semiconductor elements, and semiconductor packages to DBC substrates (copper clad substrates) or lead frames, etc. For the surface of the copper or copper alloy parts of the substrate, a silver paste containing silver powder, a thermosetting resin and a solvent is used. [0004] As such a silver paste, for example, a the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/107B22F1/054B22F7/08B82Y30/00B82Y40/00H01B1/22H05K3/32H01B13/00H01L21/52B22F1/00
CPCB22F7/08H01B1/22H01B1/02B22F1/107B22F2999/00B22F1/052B22F1/054B22F2998/10H01L24/29H01L2224/29339H01L2224/83447H01L2924/12041H01L2224/32245H01L2224/32227H01L24/27H01L2224/29294H01L2224/83486H01L2224/8384H01L2224/2929H01L24/83H01L2224/83075H01L24/05H01L2224/04026H01L2224/05644H01L2224/83192H01L2224/29291B22F7/064B22F3/1021B22F3/1039H01L2924/00014H01L2924/0541H01L2924/01029H01L2924/0103H01L2924/01079H01L2924/013H01L2924/01046H01L2924/00012H01L2924/0635H01L2924/0715H01L2924/0132H01L2924/095H01L2924/0675H01L2924/0531H01L2924/066H01L2924/0665C09J2301/314C09J1/00C09J9/02C09J11/06C09J11/08C09J2203/326
Inventor 八十岛司増山弘太郎乙川光平片濑琢磨
Owner MITSUBISHI MATERIALS CORP
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