Preparation method of high-brightness CSP (Chip Scale Package) flip LED (Light Emitting Diode)
A high-brightness, flip-chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of side brightness loss, fluorescent glue layer affecting brightness, fluorescent glue layer thickness, etc., to achieve the effect of improving service life
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Embodiment 1
[0039] The present embodiment provides a method for preparing a high-brightness CSP flip-chip LED, comprising the following steps:
[0040] Step 1, a number of 80mil LED flip chips are bonded and arranged on the high viscosity film 2 in a matrix manner, and then the high viscosity film is bonded on the crystal plate 1; You can choose a silicone material with an adhesive force of 150-400g / 20mm. like figure 1 shown.
[0041] In step 2, the surface of the LED flip-chip 3 on the crystal board 1 is sprayed with a spraying machine nozzle 4 at 140 degrees with a fluorescent glue 5 to form a fluorescent glue layer 6; the preparation method of the fluorescent glue 5 is as follows: YAG aluminate 10 g of salt yellow powder and green powder, 6 g of silica gel, 3 g of o-xylene, and 0.06 g of nano-scale silica are mixed uniformly, and the thickness of the formed fluorescent glue layer 6 is 30 μm. like figure 2 and 3 shown.
[0042] Step 3, inject transparent silica gel on the die pla...
Embodiment 2
[0046] This embodiment provides a preparation method of a high-brightness CSP flip-chip LED, the LED structure is as follows Figure 7 As shown, the difference from Example 1 is: 1) The mold used in the lamination process has a reticular structure formed by interlaced annular threads and vertical threads that diverge outward from the center, and then formed on the elliptical lens surface of the LED. There is a network structure f formed by interlaced annular threads and vertical threads that diverge outward from the top center. 2) The fluorescent powder in the fluorescent glue solution is nitride red powder. 3) The convex angle of the elliptical lens surface is 100°.
[0047] The luminous efficiency of the CSP flip-chip LED obtained in this example is 210lm / W.
Embodiment 3
[0049] This embodiment provides a method for preparing a high-brightness CSP flip-chip LED, and the difference from Embodiment 2 is that the convex angle of the elliptical lens surface is 170°.
[0050] The luminous efficiency of the CSP flip-chip LED obtained in this example is 220lm / W.
[0051] Figure 8 The light-emitting principle diagrams of the smooth lens of Example 1 and the helical textured lens of Examples 2 and 3 are given. Compared with the smooth lens, the helical textured lens will perform secondary light mixing on the output light, and the mixed light spot will be more uniform, and the lens will be more uniform. The spiral pattern on the surface will reduce the reflection of the light, so it will improve the light extraction to a certain extent. Compared with the ordinary lens, the brightness will increase by 2-10%. Compared with the CSP flip-chip LED product without elliptical lens surface, the brightness can be improved. up to 20 to 30%.
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Abstract
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