Circuit board backdrill stub control method and circuit board

Abstract

The invention relates to the technical field of circuit boards, and discloses a circuit board backdrill stub control method and a circuit board. The control method comprises the following steps: providing a plurality of core boards, wherein the plurality of core boards comprise at least one marked core board; anti-plating ink is manufactured at a target position of the marked core board, the target position is located at the junction position of a back drill penetrating layer to be back-drilled and a back drill non-penetrating layer, and the anti-plating ink at least covers the peripheral area of the position to be back-drilled; after the anti-plating ink is manufactured, the multiple core plates are sequentially subjected to press fit, through hole drilling at the position to be subjected to back drilling, copper deposition, stripping and washing off of the anti-plating ink and electroplating; and back drilling is carried out at the to-be-back-drilled position, and the back drilling depth is smaller than the depth of the target position. According to the method, the influence of the back drilling depth precision on the back drilling processing can be reduced, particularly the back drilling processing of the ultra-thin core board is involved, the signal layer is prevented from being drilled through, and the influence of the back drilling stub on the signal transmission can be reduced to the greatest extent.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for controlling the back-drilling stub of a circuit board and a circuit board. Background technique [0002] At present, the depth of back drilling is mainly controlled in the following two ways: one is depth control through current induction, and the other is depth control through pressure induction. However, the machining errors of these two control methods are larger than 50 μm, and even more than 100 μm. [0003] With the development of light, thin, and miniaturized electronic products, the requirements for "light, thin, short, and small" motherboards are also increasing. The machining accuracy of the back drilling including the ultra-thin core plate position is greatly affected by the plate thickness tolerance and its uniformity, the tolerance of the back drilling equipment, etc. The back drilling needs to drill through the target layer and cannot drill thro...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a circuit board back-drilling stub control method and a circuit board, to overcome the defects of ultra-thin core board back-drilling processing yield and product quality in the prior art

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