Radiator based on phase change suppression plate and electronic equipment

Abstract

The invention provides a radiator based on a phase change suppression plate and electronic equipment, the radiator comprises a radiating substrate, the phase change suppression plate, radiating fins and a radiating pipeline, the phase change suppression plate comprises a connecting root part and a heat transfer main body part, and a preset included angle is formed between the connecting root part and the heat transfer main body part. The structure of the phase change suppression plate is changed, so that cooling air horizontally flows through the surfaces of the heat dissipation fins to take away heat, working liquid in the phase change suppression plate conveniently flows back to the heated fin root position, and heat dissipation and cooling are achieved; the fins on the phase change suppression plates enable the outer surface area of a single phase change suppression plate to be increased, the number of the phase change suppression plates is reduced under the same heat dissipation capability, and the cost is reduced. Due to the rapid heat conduction characteristic of the phase change suppression plate, the heat dissipation efficiency of a single phase change suppression plate fin is improved, and the heat dissipation capacity is improved; under the condition that the size and the weight of the electronic equipment are not increased, the heat dissipation efficiency and the heat dissipation uniformity of the electronic equipment can be greatly improved, the service life of the equipment is prolonged, and the performance of the equipment is improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a heat sink and electronic equipment based on a phase-change suppression plate. Background technique [0002] With the development of integrated circuits, high-power IGBT devices have higher and higher requirements for heat dissipation. Traditional aluminum heat sinks can no longer meet the heat dissipation requirements. A more efficient heat sink is needed to solve the heat dissipation requirements of IGBT devices. In addition, with the rapid development of 5G communication technology, the integration of power components is getting higher and higher, and the power density is also increasing. In addition to the miniaturization, light weight, high heat flux density and device average temperature of products, etc. Some all-aluminum tooth-shaping radiators or die-casting radiators are bulky and bulky, and have the disadvantages of uneven heat dissipation and low...

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a heat sink and electronic equipment based on a phase change suppression plate, which is used to solve the problems in the prior art that it is difficult to effectively realize the heat dissipation of high-power heating elements.

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