Phosphor copper ball with grooves at surface and preparation method thereof

A technology of phosphor bronze balls and phosphor bronze, which is applied in the field of phosphor bronze balls and its preparation, can solve the problems of larger size of phosphor bronze balls, waste of copper ions, fixed surface area, etc., and achieve reduced electroplating time, high utilization rate, and low cost low effect

Inactive Publication Date: 2014-06-11
东又悦(苏州)电子科技新材料有限公司
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Problems solved by technology

This kind of phosphor bronze ball with a smooth surface is prone to the following problems when it is used in electroplating: 1. The surface area of ​​the phosphor bronze ball is fixed, and only fixed copper ions can be released from the surface of the phosphor bronze ball; Each part of the copper ball forms a phosphorus film because of the different phosphorus content of each part, and the formation of the phosphorus f

Method used

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  • Phosphor copper ball with grooves at surface and preparation method thereof
  • Phosphor copper ball with grooves at surface and preparation method thereof

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Example Embodiment

[0024] The specific implementation of the present invention will be described below with reference to the drawings and embodiments of the specification.

[0025] The phosphor copper balls with grooves on the surface of this embodiment, such as figure 1 As shown, it includes a phosphor bronze ball body 1 and grooves 10 spaced apart on the surface of the phosphor bronze ball body 1. The grooves 10 are evenly distributed on the entire surface of the phosphor bronze ball body 1, and the shape is hemispherical, and all grooves The centers of 10 are all on the same sphere.

[0026] The preparation method of the phosphor copper ball with grooves on the surface is as follows:

[0027] Choose electrolytic copper or bright copper with a copper content of 99.99% as the copper raw material, and choose a phosphor-copper master alloy with a phosphorous mass content of 5-15% as the phosphorous raw material, which specifically includes the following steps:

[0028] (1) Use an intermediate frequency i...

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Abstract

The invention discloses a phosphor copper ball with grooves at the surface and a preparation method thereof. The phosphor copper ball comprises a phosphor copper ball body, and grooves arranged at the surface of the phosphor copper ball body at intervals, and the height difference between the bottoms of the grooves and the surface of the phosphor copper ball body is 1-3mm. Compared with the existing solid phosphor copper ball which is smooth and flat in surface, the phosphor copper ball with the grooves at the surface provided by the invention has large superficial area, can bear greater current, discharges more copper ions in the electroplating process, and is high in usage rate.

Description

technical field [0001] The invention relates to a phosphor copper ball with grooves on the surface for electroplating and a preparation method thereof. Background technique [0002] Anode phosphor copper ball is the main electroplating material in the copper plating process, and it is the source of copper ions. The phosphor-bronze balls prepared by the existing method for preparing phosphor-bronze balls for electroplating are all solid phosphor-bronze balls, and the surfaces of the phosphor-bronze balls are smooth and even. This kind of phosphor bronze ball with a smooth surface is prone to the following problems when it is used in electroplating: 1. The surface area of ​​the phosphor bronze ball is fixed, and only fixed copper ions can be released from the surface of the phosphor bronze ball; Each part of the copper ball forms a phosphorus film because of the different phosphorus content of each part, and the formation of the phosphorus film has a speed; Phosphorus film i...

Claims

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Application Information

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IPC IPC(8): C25D3/38B23P15/00
Inventor 刘东杰刘嘉蕙
Owner 东又悦(苏州)电子科技新材料有限公司
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