Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite adhesive film production process and application thereof in fingerprint chip packaging field

A production process and technology for fingerprint chips, applied in film/sheet release liners, adhesives, film/sheet adhesives, etc., can solve the problems of wrinkled chip sidewalls, easy pollution of the surrounding environment, whitening, etc. , to achieve the effect of improving hardness and wear resistance, improving batch stability, and facilitating molding

Pending Publication Date: 2022-08-09
东莞市溢美材料科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a kind of composite adhesive film production process, and another object of the present invention is to provide a kind of application of composite adhesive film in the field of fingerprint chip packaging; The method of spraying paint on the surface of the chip will cause undesirable phenomena such as orange peel, whitening, wrinkling, and oil accumulation on the side wall of the chip, and it is easy to pollute the surrounding environment. However, it is difficult to cover the surface of the chip with ink by silk screen printing, but it is difficult to meet customer expectations. Film hardness and abrasion resistance requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite adhesive film production process and application thereof in fingerprint chip packaging field
  • Composite adhesive film production process and application thereof in fingerprint chip packaging field
  • Composite adhesive film production process and application thereof in fingerprint chip packaging field

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0028] For the first specific implementation, please refer to Figure 1-2 , the present invention provides a technical solution: a composite film production process, including making a high-hardness wear-resistant layer, making a semi-cured adhesive layer and a composite upper and lower layer: using a precision coating machine, first coat the upper release film. High-hardness wear-resistant layer with cloth thickness of 10-25μm; coat semi-cured adhesive layer of 15-40μm thickness on the lower release film; use hot composite rollers to continuously apply the upper release film, high-hardness wear-resistant layer, semi-cured The adhesive layer and the lower release film are combined to form a roll-shaped integrated film;

[0029] The upper release film in step 1 is a mirror-surface release film, and after the adhesive film is cured, the appearance effect of a mirror surface is obtained; the lower release film in step 1 is a matte frosted release film, and the matte frosted relea...

Embodiment 1

[0035] First: select ELD type PET film with a thickness of 50 μm, ELD type PET film transmittance > 90%, haze value < 5%, apply non-silicon release agent on the film and obtain the upper release film; use Slot extrusion coating machine, coat a high-hardness wear-resistant layer with a thickness of 10-25 μm on the non-silicon release agent surface of the upper release film, use the coating machine oven to dry the solvent, and roll the material.

[0036] Secondly: apply a semi-cured adhesive layer with a thickness of 15-40μm on the release surface of the lower release film, preferably a coating thickness of 30±1μm; for the convenience of distinction, the choice of the lower release film is generally different from the color of the upper release film .

[0037] Then: use a heated composite roller to roll the high-hardness wear-resistant layer and the semi-cured adhesive layer together, and then roll the material.

[0038] Then: Die the roll film into a suitable size from the rol...

Embodiment 2

[0043] First: choose YGD type PET film with a thickness of 50 μm, the film haze value of YGD type is less than 65%, matt and matt, and apply non-silicon release agent on the film to obtain an upper release film. Then coat the release film with a slit extrusion coater, coat a high hardness wear-resistant layer with a thickness of 10-25 μm on the non-silicon release agent surface of the upper release film, and bake it with a coater oven. Dry solvent, rewinding in roll form, preferably coating thickness 25±1μm.

[0044] Secondly: apply a semi-cured adhesive layer with a thickness of 15-40μm on the release surface of the lower release film, preferably a coating thickness of 30±1μm; for the convenience of distinction, the choice of the lower release film is generally different from the color of the upper release film .

[0045] Then: use the heated composite roller to roll the high hardness wear-resistant layer and the semi-cured adhesive layer together, and then roll the material...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a composite adhesive film production process and application thereof in the fingerprint chip packaging field, and the composite adhesive film production process comprises the following steps: manufacturing a high-hardness wear-resistant layer, manufacturing a semi-cured bonding layer and compounding an upper layer and a lower layer: firstly coating an upper release film with the high-hardness wear-resistant layer with the thickness of 10-25 microns by using a precision coating machine; coating a semi-cured bonding layer with the thickness of 15-40 microns on the lower release film; continuously compounding the upper release film, the high-hardness wear-resistant layer, the semi-cured bonding layer and the lower release film by using a thermal compounding roller to form a roll-shaped integrated film; the method comprises the following steps: firstly, die-cutting a roll-shaped film into a proper size, then stripping a lower release film to expose a semi-cured bonding layer, and aligning to a coverage area of a fingerprint chip; and the semi-cured bonding layer and the coverage area of the fingerprint chip are hot-pressed together through a hot roller or hot pressing mode. According to the invention, the hardness and wear resistance of the adhesive film can be improved, the layer can be endowed with different colors, and the effects of toughening, bonding, insulating and sweat erosion resistance can be improved.

Description

technical field [0001] The invention relates to the relevant technical field of fingerprint identification, in particular to a production process of a composite adhesive film and its application in the field of fingerprint chip packaging. Background technique [0002] Biometric identification technology has entered a period of rapid development after years of development, of which fingerprint identification technology has the highest share. Among them, the capacitive fingerprint recognition sensor needs to cover the surface of the chip with a protective layer to meet certain hardness and aesthetic requirements. At present, spraying paint on the chip surface is generally used to achieve the required hardness and appearance, but this solution will cause undesirable phenomena such as orange peel, whitening, wrinkling and oil accumulation on the chip sidewall on the chip surface, and the fixture loading efficiency is low. , The utilization rate of paint is low, paint mist and v...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/40G06V40/13
CPCC09J7/25C09J7/40G06V40/13C09J2203/326C09J2301/312C09J2301/122C09J2463/00C09J2433/00C09J2467/00C09J2483/00C09J2463/006C09J2461/006C09J2483/006
Inventor 李磊孙自才刘志军黄魏张鹏飞胡安平
Owner 东莞市溢美材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com