Printed wiring substrate structure and manufacturing method thereof

Abstract

Provides a printed wiring board structure with high mechanical strength, low price, and high reliability and capacitance accuracy. The method for manufacturing a printed wiring board structure is characterized by comprising: a step of patterning a lower electrode (4a) on a portion of the substrate (2) where a capacitive element (16) is to be formed; A process of selectively forming a capacitor insulating layer (6) composed of a paste material with a high dielectric constant; forming an interlayer insulating film with a low dielectric constant on the entire surface of the substrate including the capacitor insulating layer step (8); polishing and flattening the surface of the interlayer insulating film to expose the capacitor insulating layer; and forming a capacitor element by patterning an upper electrode on the surface of the capacitor insulating layer. As a result, the mechanical strength is high and the price is low, and reliability and capacitance accuracy are also improved.

Description

technical field [0001] The present invention relates to a printed wiring board structure with built-in capacitors and a manufacturing method thereof, and more particularly to a printed wiring board structure having excellent electrical characteristics and high density and a manufacturing method thereof. Background technique [0002] With the increase in density and speed of electronic equipment in recent years, the structure of printed wiring boards has been increasingly required to respond to higher densities and higher frequencies. The miniaturization of components is being pursued in order to achieve a higher density of the printed circuit board structure. However, considering the packaging yield, the miniaturization above the current level is approaching the limit. In addition, depending on the arrangement conditions such as bypass capacitors to be packaged near the IC terminals, the package design of the printed wiring board structure becomes very difficult. [0003] I...

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Problems solved by technology

[0006] However, in this case, due to the difference in curing shrinkage and thermal expansion coefficient when the material with a high dielectric constant is cured, a gap is formed at the interface between the material with a low dielectric constant and the material with a high dielectric constant, and a conductor sneaks in. The problem of short-circuiting the lower electrode and the upper electrode in the gap and not having a capacitive function, and the problem of lack of reliability

In this case, there is a method of forming a dielectric layer using a dry processing method (sputtering, etc.) as a method of realizing the adhesive force at the interface between the low dielectric layer and the high dielectric layer, but this is not conducive to productivity and cost.

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