SiC/TiN superhard nano multi-layer film and manufacturing process thereof
A nano-multilayer, manufacturing process technology, applied in metal material coating process, coating, ion implantation plating and other directions, can solve problems such as multi-layer film material systems that have not yet been found
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Embodiment 1
[0013] The process parameters are as follows: the sputtering power of TiN target is 100W, the deposition time is 25 seconds, the sputtering power of SiC target is 60W, and the deposition time is 5 seconds. The thickness of TiN layer in the obtained TiN / SiC film is about 4.3nm, and the thickness of SiC layer is about is 0.4nm, and the hardness of the multilayer film reaches the highest value of 30.1GPa.
Embodiment 2
[0015] The process parameters are as follows: the sputtering power of TiN target is 100W, the deposition time is 25 seconds, the sputtering power of SiC target is 75W, and the deposition time is 5 seconds. The thickness of the TiN layer in the obtained TiN / SiC film is about 4.3nm, and the thickness of the SiC layer is about is 0.6nm, and the hardness of the multilayer film reaches the highest value of 60.5GPa.
Embodiment 3
[0017] The process parameters are as follows: TiN target sputtering power is 100W, deposition time is 25 seconds, SiC target sputtering power is 100W, deposition time is 5 seconds, the thickness of TiN layer in the obtained TiN / SiC film is about 4.3nm, and the thickness of SiC layer is about 0.81nm, the hardness of the multilayer film is reduced to 34.4GPa.
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