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Electron source and mfg. method thereof

An electron source, electron emission technology, applied in the manufacture of electrode systems, the manufacture of discharge tubes/lamps, the manufacture of cold cathodes, etc., can solve problems such as hindering electrical connectivity, and achieve the effect of improving reliability

Inactive Publication Date: 2005-08-17
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] It is generally believed that because the second conductor layer 108 is made of a thick film material, the thermal stress increases. According to different situations, the long element electrode 102 in the configuration of the left and right unequal lengths connected to the second conductor layer 108, due to the above-mentioned thick The thermal stress maintained by the film may be torn apart, and there may be cases where the electrical connectivity on the above-mentioned parts is significantly hindered

Method used

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  • Electron source and mfg. method thereof
  • Electron source and mfg. method thereof
  • Electron source and mfg. method thereof

Examples

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Embodiment 1

[0087] now refer to figure 1 and Figures 2A to 2E The first embodiment will be described.

[0088] In the present embodiment, the opening portion (conductive hole) 7 of the insulator 6 is formed in a ? shape, and the film thickness of the second conductor 8 is changed in stages.

[0089] First, elements 2, 3 are formed. In this example, the film was vacuum-formed by the sputtering method using a Pt intermediate electrode. The film thickness was ~0.08 μm. After forming a film on the entire surface of the substrate by sputtering, a predetermined pattern is formed by photolithography. The patterns of the element electrodes 2 and 3 are left and right non-equal length patterns ( Figure 2A ).

[0090] Then, form the first conductor 5 ( Figure 2B ). As a forming method, a screen printing method was used. The material used for printing is a screen printing paste containing Ag as a conductor component.

[0091] Then, the interlayer insulating layer 6 ( Figure 2C ). The...

Embodiment 2

[0099] now refer to Figure 10 as well as Figures 11A-11E The second embodiment will be described. Figure 10 It is a structural diagram of an electron source substrate formed by arranging surface conduction electron emission elements in a simple matrix in the image display device of this embodiment (a part of the second conductor is cut and shown), and only the crossing portion of the two conductors is shown nearby. also, Figures 11A-11E It is a process flowchart of the manufacturing method of an electron source board|substrate.

[0100] In this embodiment, the opening portion (conductive hole) 7 of the insulator 6 is formed in a rhombus shape, and the film thickness of the second conductor 8 is changed in stages.

[0101] First, the element electrodes 2 and 3 are formed. In this example, the film was vacuum-formed by sputtering using a Pt intermediate electrode. The film thickness was, -0.08 μm. After forming a film on the entire substrate surface by cathode sputter...

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Abstract

The invention provides an electron source and mfg. method thereof. In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.

Description

technical field [0001] The present invention relates to a method of manufacturing an electron source including wiring and an electron emission portion connected thereto. technical background [0002] Conventionally, two types of thermionic electron sources and cold cathode electron sources are known as electron emission elements. Among cold cathode electron sources, there are field emission type (hereinafter referred to as EF), metal / insulator / metal (hereinafter referred to as MIM), and surface conduction type electron emission elements. [0003] As an example of the EF type, W.P. Dyke & W.W. Dolan, "Fieldmission", Advance in Electron Physics, 8, 89, (1956) and the like are known. [0004] As an example of the MIM type, C.A. Mead, "Tunnel-emission amplifier", J, Appl. Phys, 32, 646 (1961) and the like are known. [0005] As an example of a surface conduction type electron emission element, there are M.I.Elinson, RadioEng.Electron Phys., 10, (1956) and the like. [0006] T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J1/316H01J9/02
CPCH01J9/027H01J1/316
Inventor 户岛博彰石渡和也宇田芳己
Owner CANON KK