Electron source and mfg. method thereof
An electron source, electron emission technology, applied in the manufacture of electrode systems, the manufacture of discharge tubes/lamps, the manufacture of cold cathodes, etc., can solve problems such as hindering electrical connectivity, and achieve the effect of improving reliability
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Embodiment 1
[0087] now refer to figure 1 and Figures 2A to 2E The first embodiment will be described.
[0088] In the present embodiment, the opening portion (conductive hole) 7 of the insulator 6 is formed in a ? shape, and the film thickness of the second conductor 8 is changed in stages.
[0089] First, elements 2, 3 are formed. In this example, the film was vacuum-formed by the sputtering method using a Pt intermediate electrode. The film thickness was ~0.08 μm. After forming a film on the entire surface of the substrate by sputtering, a predetermined pattern is formed by photolithography. The patterns of the element electrodes 2 and 3 are left and right non-equal length patterns ( Figure 2A ).
[0090] Then, form the first conductor 5 ( Figure 2B ). As a forming method, a screen printing method was used. The material used for printing is a screen printing paste containing Ag as a conductor component.
[0091] Then, the interlayer insulating layer 6 ( Figure 2C ). The...
Embodiment 2
[0099] now refer to Figure 10 as well as Figures 11A-11E The second embodiment will be described. Figure 10 It is a structural diagram of an electron source substrate formed by arranging surface conduction electron emission elements in a simple matrix in the image display device of this embodiment (a part of the second conductor is cut and shown), and only the crossing portion of the two conductors is shown nearby. also, Figures 11A-11E It is a process flowchart of the manufacturing method of an electron source board|substrate.
[0100] In this embodiment, the opening portion (conductive hole) 7 of the insulator 6 is formed in a rhombus shape, and the film thickness of the second conductor 8 is changed in stages.
[0101] First, the element electrodes 2 and 3 are formed. In this example, the film was vacuum-formed by sputtering using a Pt intermediate electrode. The film thickness was, -0.08 μm. After forming a film on the entire substrate surface by cathode sputter...
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