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Semiconductor configuration and making process

A semiconductor and non-conductor technology, applied in the field of flip-chip ball grid array structure and its manufacturing, can solve the problems of time-consuming, large difference in thermal expansion coefficient, increased cost, etc.

Inactive Publication Date: 2005-11-02
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the small size of the tin-lead bumps on the flip-chip chip, the thermal expansion coefficient gap with the high-density substrate is too large, so it is necessary to fill the gap between the chip, the substrate and the bumps with epoxy underfill during production to increase reliability. , however this process is time consuming and increases the cost

Method used

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  • Semiconductor configuration and making process
  • Semiconductor configuration and making process
  • Semiconductor configuration and making process

Examples

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Embodiment Construction

[0017] While the present invention is described in detail with the following embodiments, those skilled in the art should realize that the present invention allows several modifications and substitutions without departing from the scope of the proposed patent. The structures or methods used to disclose are not limited to specific package components, but also include other equivalent semiconductor package components, and the illustrations are also used to illustrate preferred embodiments, not to limit the scope of the present invention.

[0018] Different parts of the semiconductor package device of the present invention are not drawn to scale. Certain dimensions have been exaggerated compared to other relevant dimensions to provide a clearer description and understanding of the invention. In addition, although in these embodiments are shown in two dimensions with width and depth in different stages, it should be clearly understood that the shown area is only a part of the pack...

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Abstract

The present invention aims at providing one kind of semiconductor configuration element including one notch or one channel on one carrier plate. There are at least one chip with one back and one active plane with the first soldering pads and fixed in the notch while exposing its active plane; one first insulating layer on the carrier plate and the active plane with first conducting through holes contained to the first soldering pads; and one multilayer structure on the first insulating layer and with wires in it, the second conducting through holes inside it at least one second insualting layer and exposed soldering tin ball pads. The wires, the second conducting through holes and the soldering tin ball pads of the multilayer structure are connected electrically with the first conducting through holes.

Description

(1) Technical field [0001] The present invention relates to a semiconductor structure and its manufacturing method, in particular to a flip-chip ball grid array structure and its manufacturing method. (2) Background technology [0002] In the assembly process, especially in the flip-chip ball grid array assembly process of high-pin-count integrated circuits or small-area low-pin-count integrated circuits, the output / input pads on the chip must be redistributed. process) to rearrange it into an array, and then form a UBM (Under Bumping Metallization) metal layer and a solder bumper. Since the general printed circuit board (Print Circuit Board, PCB) cannot match the integrated circuit with high-density output / input pins in the process layout, it is necessary to first bond the flip-chip chip to the high-density substrate (Build-Upsubstrate), and then The I / O pins of the chip are converted and diffused (fan-out) into a distribution with a larger area and pitch through a high-de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/12H01L23/48
CPCH01L24/19H01L2924/0002H01L2224/19H01L2924/14H01L2924/00H01L2924/00012
Inventor 蔡振荣李睿中林志文
Owner MACRONIX INT CO LTD