Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Piezo ink-jet head and shaking layer shaping method

A technology of vibrating layer and forming method, which is applied in printing and other directions, can solve the problems of unfavorable mass production, high difficulty, cumbersome process, etc., and achieve the effects of increased pass rate, reduced cost, and low process difficulty

Inactive Publication Date: 2005-11-23
宇虹科技公司
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the known piezoelectric inkjet head technology mostly adopts the co-firing method of base-layer laminated ceramics to form components such as vibrating plates and ink chambers, and the forming method includes powder raw materials (PZT, ZrO 2 , PbO, TiO 2 , other appropriate additives) steps such as synthesis, mixing, drying, calcination, crushing, granulation, compression, molding, sintering and polarization, but due to the tedious and difficult process mentioned above, there has always been a low pass rate , high cost, unfavorable mass production and other disadvantages

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Piezo ink-jet head and shaking layer shaping method
  • Piezo ink-jet head and shaking layer shaping method
  • Piezo ink-jet head and shaking layer shaping method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as Figures 3A to 3F , which shows a schematic cross-sectional view of the forming technology of the vibration layer of the piezoelectric inkjet head according to Embodiment 1 of the present invention.

[0037] Such as Figure 3A As shown, a first silicon chip 52 and a second silicon chip 54 are provided, and an oxidation process is performed to form a first SiO on the bonding surface of the first silicon chip 52. 2 layer 51a, and form a second SiO on the bonding surface of the second silicon chip 54 2 Layer 51b.

[0038] Such as Figure 3B As shown, silicon-on-insulator (SOI) technology is used to form a tight bond between the bottom of the first silicon chip 52 and the bonding surface of the second silicon chip 54 . In a preferred embodiment, a hydrogen-bonding solvent (such as acetone or alcohol) can be formed on the bottom surface of the first silicon chip 52 and the top surface of the second silicon chip 54 by spin coating or spraying. , so that the first...

Embodiment 2

[0046] The vibration layer forming technology of the piezoelectric inkjet head in the second embodiment of the present invention is roughly the same as the steps described in the first embodiment. Silicon technology, which can further reduce production costs and simplify the production process.

[0047] Such as Figures 4A to 4F , which shows a schematic cross-sectional view of the forming technology of the vibration layer of the piezoelectric inkjet head according to the second embodiment of the present invention.

[0048] Such as Figure 4A As shown, a first silicon chip 52 and a second silicon chip 54 are provided, and a first bonding layer 51c is formed on the bottom surface of the first silicon chip 52, and a second bonding layer 51c is formed on the top surface of the second silicon chip 54. Layer 51d. In a preferred embodiment, the bonding material of the first bonding layer 51c and the second bonding layer 51d can be: resin, phosphosilicate glass (PSG), spin on glas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A process for preparing the vibration layer of piezoelectric ink-jet printhead includes such steps as providing the first and the second silicon chips, respectively generating an adhering layer on them, adhering them together, grinding to make the thickness of the first silicon chip equal to 5-20 microns for using it as the vibration layer, providing a mask with several windows on the bottom of the second silicon chip, and etching to remove the second silicon chip in the windows to form several ink cavities.

Description

technical field [0001] The invention relates to a molding technology of a vibration layer of a piezoelectric inkjet head, in particular to a method for forming the vibration layer and an ink chamber of a piezoelectric inkjet head by using technologies such as bonding, grinding, and etching of a silicon chip. Background technique [0002] The main operating principles of inkjet printing technology are divided into two types: Thermal bubble and Piezoelectric. The thermal bubble type uses a heater to instantly vaporize the ink, and generates high-pressure bubbles to push the ink out of the nozzle. However, due to its high-temperature vaporization operation principle, the selectivity of applicable liquids is low, so its application field is limited. Piezoelectric, such as disclosed in U.S. Patent US-A-5739832 and Japanese Patent Application JP-A-10-264389, is to use the method of applying voltage to deform piezoelectric ceramics, and generate high voltag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/14B41J2/16
Inventor 季宝琪蔡志昌林振华杨明勋
Owner 宇虹科技公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com