Thin permanent-magnet film and process for producing same
A technology for permanent magnets and manufacturing methods, which is applied in the direction of magnetic film, inductor/transformer/magnet manufacturing, manufacturing base layer, etc., can solve the problem that the residual magnetic flux density is not obtained, the value is low, and the rare earth alloy magnetic thin film metal cannot be fully controlled organizational issues
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Examples
Embodiment 1
[0059] In this example, firstly, using a DC diode magnetron sputtering device, Al 2 o 3 - On a TiC ceramic substrate, several samples of refractory metal layers composed of any of Ta, Nb, Zr, and Ti layers and Nd-Fe-B alloy layers (rare earth alloy magnetic layers) were laminated alternately. In this example, the total thickness of the Nd—Fe—B alloy layers was specified to be 1000 nm (200 nm×5) for all the samples. The lamination structure and magnetic properties in each sample are shown in Table 1 below.
[0060] sample
No.
stacked structure
In-plane
Vertical film direction
B r1
(T)
h cJ
(kA / m)
B r2
(T)
h cJ
(kA / m)
1
comparative example
Substrate / Nd-Fe-B(1000nm)
0.20
263
0.61
509
2
Example
substrate /
[Ti(20nm) / Nd-Fe-B(200nm)]×5
0.25
422
0.89
844
3
...
Embodiment 2
[0068] In this example, a DC diode magnetron sputtering device was used to produce Al 2 o 3 - On a TiC ceramic substrate, a 5-layer sample in which a 20 nm Ta layer and a 200 nm Pr-Fe-B alloy layer are alternately laminated, and a sample in which only the Pr-Fe-B alloy layer is formed to a thickness of 1000 nm. For each sample, the lamination structure and magnetic properties are shown in Table 2 below.
[0069] sample
No.
stacked structure
In-plane
Vertical film direction
B r1
(T)
h cJ
(kA / m)
B r2
(T)
h cJ
(kA / m)
14
comparative example
Substrate / Pr-Fe-B(1000nm)
0.21
231
0.65
485
15
Example
substrate /
[Ta(20nm) / Pr-Fe-B(200nm)]×5
0.16
478
0.83
>1194
[0070] Here, sample No. 15 is an example of the present invention, and sample No. 14 is a comparative example...
Embodiment 3
[0075] In this example, the DC diode sputtering method is used to fabricate the water-cooled Al 2 o 3 - On the TiC ceramic substrate, 5 layers of samples with 20nm Ta layer and 200nm Nd-Fe-B alloy layer were alternately laminated, and a sample with only 1000nm Nd-Fe-B alloy layer formed into a film. For each sample, the lamination structure and heat treatment conditions are shown in Table 3 below.
[0076] Sample No.
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Abstract
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