Method for changing solid film material surface soakage

A film material and surface infiltration technology, which is used in the field of changing the surface wettability of solid film materials by needle type printers, can solve the problems of expensive equipment, radioactive pollution, complicated operation process, etc., and achieve large-scale rapid preparation, easy operation, and equipment simple effect

Inactive Publication Date: 2006-11-08
INST OF CHEM CHINESE ACAD OF SCI
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] (1) Waste is generated during the chemical modification process, which pollutes the environment
[0018] (2) Radioactive contamination during radiation treatment
[0019] (3) The equipment used for vacuum evaporation and plasma treatment is expensive and the operation process is complicated

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for changing solid film material surface soakage
  • Method for changing solid film material surface soakage
  • Method for changing solid film material surface soakage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] When the dot matrix printer used is Epson LQ300K+, at room temperature, use laser etching to modify the micron structure on the surface of the printing needle, the groove size is 6-7 microns, and print on the surface of 0.2mm thick aluminum foil. The contact angle of the aluminum foil surface changed from 49.6° to 68.8°.

Embodiment 2

[0039] When the stylus printer used is Epson LQ300K+, at room temperature, use laser etching to modify the surface of the printing needle with a micron structure, the groove size is 3-5 microns, and print on the surface of 0.02mm thick tin foil. The surface contact angle of tin foil changed from 41.6° to 96.2°.

Embodiment 3

[0041] When the stylus printer used is Epson LQ300K+, at room temperature, use laser etching to modify the surface of the printing needle with micron and nanostructures, the aperture size is 0.1-2 microns, and print on the surface of 0.02mm thick copper foil. The contact angle of copper foil surface changed from 45.4° to 61.8°.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
contact angleaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the field of surface modification of solid materials, in particular to a method for changing the surface wettability of thin film materials. The method for changing the wettability of the surface of the solid film material of the present invention is to use an ordinary dot matrix printer at normal temperature to modify the surface of the printing needle with a micron or micron and nanostructure, remove the ribbon, and directly print the film material, which can Micro and nanostructures are printed on the surface of the material, and the change of surface roughness can be used to change the contact angle between the surface of the film material and water, so that the wettability of the surface of the film material can be changed differently. The method of the invention has simple equipment, low cost and no environmental pollution, and can quickly and large-area prepare micron and nanostructures on the surface of the thin film material at normal temperature, thereby changing the wettability of the material surface.

Description

technical field [0001] The invention belongs to the field of surface modification of solid materials, in particular to a method for changing the wettability of the surface of solid thin film materials by using a needle printer. Background technique [0002] Solid surface modification is not only a hot topic in surface chemistry, but also an important research topic in interface engineering. It has very broad application prospects in industrial and agricultural production and people's daily life. After the solid surface is modified, a series of properties such as adsorption, infiltration, and dispersion will change due to changes in surface properties. Wettability is one of the important properties of solid surface. Among the two main factors that determine the wettability of a solid surface, the chemical properties are the internal cause, and the geometric structure and morphology are also an indispensable important factor. Wettability can be ch...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B29C59/00
Inventor 郭朝维冯琳江雷
Owner INST OF CHEM CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products