Lead-free solder

A solder and aluminum solder technology, applied in welding/cutting media/materials, welding media, manufacturing tools, etc., can solve the problems of easy peeling and insufficient connection strength of the solder

Inactive Publication Date: 2001-09-19
NIPPON SHEET GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, Sn-Ag-In solder is disclosed in JP-9-326554, and Sn-Zn-Bi solder is disclosed in JP-8-164495, but these two solders are not suitable for glass, ceramics When soldering oxide materials such as solder, there is a problem that the joint strength of the solder is insufficient
[0008] In addition, as a lead-free solder that can solder metal oxides, for example, Sn-Ag-Al-Zn solder is disclosed in Japanese Patent Publication No. 55-36032. However, since a metal is selected as an object to be joined, the When used for oxide materials such as glass and ceramics with large thermal expansion coefficients, there is a problem of easy peeling

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10

[0046] Soda-lime glass (50×50×3mm) was used as the material to be joined, and a lead-free solder having the composition shown in Table 1 was melt-welded to the glass plate using an ultrasonic soldering iron that vibrates the tip of the soldering iron at a frequency of 60 kHz. Above, samples of the present example and samples of the comparative example were produced. The compositions in the tables are all expressed in weight %.

[0047]The bonding performance between the glass plate and the lead-free solder was evaluated by the degree of peeling of the lead-free solder when the lead-free solder layer soldered on the surface of the glass plate was peeled off with a knife. In the column of bonding performance in Table 1, ○ indicates that half or more of the solder layer remained on the glass plate without peeling off, and × indicates that the solder layer was completely peeled off.

[0048] Example 1

[0049] It can be seen from Table 1 that the liquidus temperature ...

Embodiment 11-20

[0056] Soda-lime glass (50×50×3mm) was used as the material to be joined, and lead-free solder having the composition shown in Table 3 was melt-welded to the glass plate using an ultrasonic soldering iron that vibrated the tip of the soldering iron at a frequency of 6 kHz. Above, the samples of this example were made. The compositions in the tables are all expressed in weight %.

[0057] As in Examples 1-10 above, the bonding performance between the glass plate and the solder was evaluated by the degree of peeling of the lead-free solder when the solder layer bonded to the surface of the glass plate was cut with a knife. In the column of bonding performance in Table 3, ○ indicates that half or more of the solder layer remained on the glass plate without peeling off, and × indicates that the solder layer was completely peeled off.

[0058] Example 11

[0059] As can be seen from Table 3, in addition to the ingredients shown in claims 1-11, the samples of this embod...

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Abstract

A lead-free solder alloy substantially contains Sn and Ti, and has a temperature of a liquidus line of not greater than 400 DEG C. The lead-free solder alloy contains no toxic lead and has sufficient bonding strength to oxide materials such as glass and ceramics.

Description

field of invention [0001] The present invention relates to lead-free solder for soldering oxide materials such as ceramics and glass at low temperature. Background of the invention [0002] As we all know, in the past, in order to solder oxide materials such as ceramics and glass, electroplating or electroless plating such as gold plating, copper plating, nickel plating, etc. were required in advance, but the cost of soldering the electroplated surface is high and the technology is complicated. Therefore, a technology capable of more economical soldering is required. [0003] To meet this demand, for example, Japanese Patent Publication No. 49-22299 and Japanese Patent Publication No. 52-21980 disclose Pb—Sn based solders that can be directly soldered to glass or ceramics. [0004] However, lead is a highly toxic metal. In recent years, due to concerns about the impact of lead on health and the environment, the adverse impact and pollution of lead on the ecosystem have attr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00C22C13/02
CPCC22C13/00C22C13/02B23K35/262B23K35/26
Inventor 堂见新二郎坂口浩一中垣茂树菅沼克昭
Owner NIPPON SHEET GLASS CO LTD
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