Polyester film and its producing method

A technology of polyester film and manufacturing method, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, and other household appliances, and can solve the problems of epoxy resin denaturation, equipment investment, and increased processing procedures, and achieve excellent formability and reliability The effect of high precision in manufacturing and plate thickness

Inactive Publication Date: 2002-10-16
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method can prevent the generation of resin powder from the polyester film, it has problems such as denaturation of the epoxy resin due to melting, which requires investment in equipment, and increases the number of processing steps.

Method used

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  • Polyester film and its producing method
  • Polyester film and its producing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] use figure 1 The shown prepreg manufacturing apparatus produces a prepreg consisting of an inner layer impregnated with epoxy resin in a glass fiber woven cloth and an outer layer coated with epoxy resin on both sides of the inner layer.

[0035] for every 1m 2 The glass woven fabric sold on the market with a weight of 104g is opened by a known opening process method to open the threads constituting the warp and weft to obtain a thickness of 0.1mm and an air permeability of 10cm. 3 / cm 2 / sec of glass weave. Air permeability was measured by the same method as above.

[0036] In 100 parts by weight of methyl ethyl ketone, 70 parts by weight of a bisphenol A epoxy resin having an epoxy equivalent of about 450 and 30 parts by weight of a novolac epoxy resin with an epoxy equivalent of about 190 were dissolved. Add the solution of dissolving 3 parts by weight of dicyandiamide and 0.15 parts by weight of 2-phenol-4-methylimidazole in 20 parts by weight of dimethylform...

Embodiment 2

[0042] Except that the epoxy resin varnish (I) is replaced in the (d) process, and the epoxy resin varnish (II) is used to form the outer layer b, the rest are the same as in Example 1, and the inner layer a and the inner layer A prepreg consisting of an outer layer b formed on both sides of layer a. As a result, the reaction rate of the inner layer a was 87%, and that of the outer layer b was 59%. Comparative example 1

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Abstract

The present invention provides a polyester film, which consists of an inner layer impregnated with epoxy resin in a glass fiber matrix material whose weight per 1 m2 is more than 40 g and less than 115 g, and whose air permeability is less than 20 cm3 / cm2 / sec. At least one side of the layer is composed of an outer layer coated with epoxy resin, the reaction rate of the epoxy resin in the inner layer is more than 85%, and the reaction rate of the epoxy resin in the outer layer is less than 60%, which can be optimized. The molded laminated board or multilayer circuit board has excellent thickness accuracy and formability.

Description

technical field [0001] The present invention relates to a prepreg with high thickness precision and excellent formability and a method for producing the same, and more particularly to a prepreg capable of forming offset holes by laser processing and a method for producing the same. The prepreg obtained by the present invention can be suitably used, for example, as substrates for cellular phones, personal computers, operating bus memories, and PDAs, which require high-frequency characteristics. Background technique [0002] In recent years, laminated boards for circuit boards and multilayer circuit boards use higher frequencies than before, and the requirements for the physical properties of their materials are also becoming stricter. In particular, we have conducted research on circuit board materials for circuit signal delay from the prior art, and have developed resins with controlled impedance by lowering the dielectric constant of circuit boards and improving the accurac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/06B29B15/12C08J3/24C08J5/24H05K1/03H05K3/46
CPCB29B15/122B29K2063/00C08J3/245C08J2363/00H05K1/0366H05K2203/0783H05K2203/1476Y10S428/901B29B15/125Y10T428/24917Y10T428/31529Y10T428/31623C08J5/244B29C70/06
Inventor 山地贵志小松守
Owner SUMITOMO BAKELITE CO LTD
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