Nano composite material of epoxy resin/clay for copper foil base plate
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- IND TECH RES INST
- Publication Date
- 2003-05-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a nanocomposite material and its application, and in particular to an epoxy resin / clay nanocomposite material and its application in circuit substrates. Background technique
[0002] It is known from the commercial material example of nylon 6 / clay nanocomposite material that when the inorganic mineral material is dispersed in the polymer matrix in a layered form, the mechanical strength of the composite material, the improvement of the heat distortion temperature, and the gas barrier property are greatly improved. It has the effect of additive improvement with physical properties such as water resistance. Since epoxy resin has been widely used in the electronics industry, its application on copper foil substrates has become increasingly unsatisfactory due to the limitations of heat resistance, water absorption and dimensional stability. Contents of the invention
[0003] Therefore, the present invention utilizes the clay hav...