Nano composite material of epoxy resin/clay for copper foil base plate

A technology of nanocomposite material and epoxy resin, which is applied in nanocomposite material and its application field, can solve problems such as unsuitability, heat resistance, water absorption and dimensional stability limitations

Inactive Publication Date: 2003-05-07
IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since epoxy resin is widely used in the electronics industry, due to the limitations of heat resistance, water absorption and dimensional stability, the application on copper foil substrates has become increasingly unsatisfactory.

Method used

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  • Nano composite material of epoxy resin/clay for copper foil base plate
  • Nano composite material of epoxy resin/clay for copper foil base plate
  • Nano composite material of epoxy resin/clay for copper foil base plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0029] Embodiment: add the clay that the present invention is modified with two kinds of modifying agents

[0030] The clay is modified by mixing DICY and BEN (or TEP and BEN) before use. Disperse 50g of clay evenly in 4500ml of water and swell for more than 4 hours, then slowly add appropriate amount of modifying solution under vigorous stirring: (a) 1.25g DICY, 30ml 1M HCI and 172ml 10wt% BEN aqueous solution or (b ) 2.85g TEP, 20ml 1M HCl or (c) 172ml 10wt% BEN in water. Stirring was continued at room temperature for another 6 hours after this step was completed.

[0031] The clay suspension that has been exchanged is filtered, and the obtained filter cake is washed with deionized water twice, and this is repeated three times. The washed filter cake is dried and crushed. The obtained samples are expressed as NCY / BEN / clay and TEP / BEN / clay, respectively. The preparation of epoxy resin / clay glass fiber substrate is to dissolve 2.6gDICY, 105.6g EB453 epoxy resin and a small...

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PUM

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Abstract

A nano epoxy resin / clay composition for the copper foil substrate is composed of a high-molecular matrix containing epoxy resin and a laminated clay material. It is prepared through preparing the modified clay by intercalating clay with the mixture of benzalkonium chloride and dicyanoamine or tetraethylidenje pentamine and cross-linking with oligomer of epoxy resin. Its advantages are low hydroscopicity and high size stability and refractory nature.

Description

technical field [0001] The invention relates to a nanocomposite material and its application, and in particular to an epoxy resin / clay nanocomposite material and its application in circuit substrates. Background technique [0002] It is known from the commercial material example of nylon 6 / clay nanocomposite material that when the inorganic mineral material is dispersed in the polymer matrix in a layered form, the mechanical strength of the composite material, the improvement of the heat distortion temperature, and the gas barrier property are greatly improved. It has the effect of additive improvement with physical properties such as water resistance. Since epoxy resin has been widely used in the electronics industry, its application on copper foil substrates has become increasingly unsatisfactory due to the limitations of heat resistance, water absorption and dimensional stability. Contents of the invention [0003] Therefore, the present invention utilizes the clay hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C08L63/00
Inventor 蔡宗燕钟松政叶安祺江泽修方博仁
Owner IND TECH RES INST
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