Nano composite material of epoxy resin/clay for copper foil base plate

A technology of nanocomposite material and epoxy resin, which is applied in nanocomposite material and its application field, can solve problems such as unsuitability, heat resistance, water absorption and dimensional stability limitations
CN1415659AInactive Publication Date: 2003-05-07IND TECH RES INST +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
IND TECH RES INST
Publication Date
2003-05-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

A nano epoxy resin / clay composition for the copper foil substrate is composed of a high-molecular matrix containing epoxy resin and a laminated clay material. It is prepared through preparing the modified clay by intercalating clay with the mixture of benzalkonium chloride and dicyanoamine or tetraethylidenje pentamine and cross-linking with oligomer of epoxy resin. Its advantages are low hydroscopicity and high size stability and refractory nature.
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Description

technical field

[0001] The invention relates to a nanocomposite material and its application, and in particular to an epoxy resin / clay nanocomposite material and its application in circuit substrates. Background technique

[0002] It is known from the commercial material example of nylon 6 / clay nanocomposite material that when the inorganic mineral material is dispersed in the polymer matrix in a layered form, the mechanical strength of the composite material, the improvement of the heat distortion temperature, and the gas barrier property are greatly improved. It has the effect of additive improvement with physical properties such as water resistance. Since epoxy resin has been widely used in the electronics industry, its application on copper foil substrates has become increasingly unsatisfactory due to the limitations of heat resistance, water absorption and dimensional stability. Contents of the invention

[0003] Therefore, the present invention utilizes the clay hav...

Claims

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