Modified laminated clay and epoxy resin/clay nano composite material comprising said clay

A technology of nanocomposite materials and layered clay, which is applied in the field of epoxy resin/clay nanocomposite materials, and can solve problems such as non-compliance with needs

Inactive Publication Date: 2003-03-26
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since epoxy resin is widely used in the electronics industry, due to the limitations of heat resistance, adhesiveness, water absorption and dimensional stability, its application in packaging and construction materials has become increasingly unsatisfactory.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example

[0021] Preparation Example: Clay Modification Treatment

[0022] Clay is modified with modifier before use. First disperse 60g of clay evenly in 3500ml of water and swell for more than 4 hours, then slowly add 140g of modifying liquid (60gZr 2 OCl 2 Dissolve in 500mlH 2 O, then NH 4 OH to adjust the pH to 0.83). Stirring was continued for a further 1 hour at 80°C. After this step is completed, it is aged at 80° C. for 20 days. The clay suspension that has been exchanged is filtered, and the obtained filter cake is washed with deionized water twice, and this is repeated three times. The washed filter cake was redispersed in 3500ml of water, then dropped into 48.6g of silane modifier [(OCH 3 ) 3 ((CH 2 ) 3 OCH 2 CHCH 2 O) Si], and then reacted at 80°C for 6 hours. The obtained sample is filtered, dried and pulverized at 100°C to obtain the modified clay.

[0023] Each sample shows through X-ray diffraction spectrometer (XBD) analysis, ZrOCl 2 After modification, t...

Embodiment 1

[0027] Embodiment 1: add modified clay 3wt% of the present invention

[0028] In this experiment, the fused silica fillers with different particle sizes are first weighed, which come from Denka Fused Silica Filler (manufactured by Denki Kagaku Kogyo Company), and the models are FS-30 (6.2um), FS-90C (17.3um ), FB-48 (16.5um), FB-74 (19.8um) and FB-301 (6.8um), the dosage is 40.0, 29.2, 166.2, 340.2 and 64.3 grams, and add the nano-scale filling prepared in the preparation example 3.9 grams of material (3wt% for the total resin content), wherein the amount of filler accounts for 82.3% of the total weight, after uniform mixing, with silane surface treatment agent (OCH 3 ) 3 ((CH 2 ) 3 OCH 2 CHCH 2 O) 3.2 grams of Si for processing, then add 12.0 grams of spherical silicon powder with an average particle size of 2 μm, flame retardant (Sb 2 o 3 ) and brominated epoxy resin Epiclon 152 (produced by Epiclon Company) each 2.4 grams, release agent number WAX OP and E each 0.8, ...

Embodiment 2

[0031] Embodiment 2: add modified clay 3wt% of the present invention

[0032] In this experiment, the fused silica fillers with different particle sizes are first weighed, which come from Denka Fused Silica Filler (manufactured by Denki Kagaku Kogyo Company), and the models are FS-30 (6.2um), FS-90C (17.3um ), FB-48(16.5um), FB-74(19.8um) and FB-301(6.8um), the usage amounts are 34.34, 69.2, 286.24, 186.24 and 74.78 grams, and the nano-scale filling prepared in the preparation example is added 3.9 grams of material (3wt% for the total resin content), wherein the amount of filler accounts for 83.9% of the total weight, after uniform mixing, with silane surface treatment agent (OCH 3 ) 3 ((CH 2 ) 3 OCH 2 CHCH 2 O) 3.2 grams of Si are processed, then add 12.0 grams of spherical silicon powder with an average particle size of 2 μm, flame retardant (Sb 2 o 3 ) and brominated epoxy resin Epiclon152 (produced by Epiclon Company) each 2.4 grams, release agent number WAX OP and ...

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PUM

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Abstract

The invention refers to a kind of modified layer clay, it includes layer clay materials, which is made up of ZrOCl2 and silane surface processing agent by blending, inserting and modifying them. The invention also refers to a kind of epoxy resin / clay nano compound material, it includes high molecular base which contains epoxy resin and layer clay materials. The manufactured modified layer clay carries on association with epoxy resin scant polymer, the inorganic layer materials are dispersed into epoxy resin base evenly to produce epoxy resin material which contains nano layer silicate clay in order to achieved the aim of decreasing bibulous ability and enhancing the binding property.

Description

technical field [0001] The invention relates to a modified layered clay and an epoxy resin / clay nanocomposite material prepared by using the modified clay, which can be applied to encapsulation and construction materials. Background technique [0002] It is known from the commercial material example of nylon 6 / clay nanocomposite material that when the inorganic mineral material is dispersed in the polymer matrix in a layered form, the mechanical strength of the composite material, the improvement of the heat distortion temperature, and the gas barrier property are greatly improved. It has the effect of additive improvement with physical properties such as water resistance. Since epoxy resin has been widely used in the electronics industry, its application in packaging and construction materials has become increasingly unsatisfactory due to the limitations of heat resistance, adhesiveness, water absorption and dimensional stability. Contents of the invention [0003] There...

Claims

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Application Information

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IPC IPC(8): C08K3/34C08L63/00
Inventor 蔡宗燕康鸿洲鄞盟松徐国原钟松政
Owner IND TECH RES INST
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