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Black composite particles for semiconductor sealing material use and semiconductor sealing material

A technology of composite particles and sealing materials, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve the problem of low resistance of semiconductor sealing materials

Inactive Publication Date: 2003-08-20
TODA IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these technologies, since carbon black and silica particles are added to the binder resin, respectively, the resulting semiconductor sealing material has low resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0225] (Manufacture of black composite particles (I))

[0226] Silica particles (particle shape: spherical, original average particle size 0.45μm, sphericity 1.02, BET specific surface area value 5.4m 2 / g, liquidity index 52, L * Value 93.1, a * Value 0.4, b * Value 0.3, C * Value 0.5) and black pigment (type: carbon black (furnace carbon black), particle shape: granular, original average particle size 0.022μm, BET specific surface area value 133.5m 2 / g, L * Value 14.6) pre-mixed so that the black pigment relative to 100 parts by weight of the silica particles, converted to 10 parts by weight in terms of C, was added to Mikaner Fujiman AMS-Lab (manufactured by Mikami Kron Co., Ltd.), and subjected to mechanochemical reaction , The black composite particles (I) with black pigment attached to the surface of the silica were obtained.

[0227] The prepared black composite particles (I) are spherical particles with an original average particle size of 0.45 μm and a sphericity of 1.04...

Embodiment 2

[0232] (Manufacture of black composite particles (II))

[0233] While the mill was running, 70 g of methylhydrodiene polysiloxane (trade name: TSF484: manufactured by GE Toshiba Silicone Co., Ltd.) was added to 7.0 kg of silica particles (particle shape: spherical, original average particle size) 0.45μm, sphericity 1.02, BET specific surface area value 5.4m 2 / g, liquidity index 52, L * Value 93.1, a * Value 0.4, b * Value 0.3, C *In the value 0.5), mixing and stirring were performed for 30 minutes with a line load of 588 N / cm (60 Kg / cm), and the stirring speed at this time was 22 rpm.

[0234] Then, while the crusher was running, 700g of black pigment (type: carbon black (furnace carbon black) was added within 30 minutes, particle shape: granular, original average particle size 0.022μm, BET specific surface area value 133.5 m 2 / g, L * Value 14.6) Mix and stir, and then mix and stir for 30 minutes with a line load of 588N / cm (60Kg / cm) to make the black pigment adhere to the methy...

Embodiment 3

[0241] (Manufacture of black composite particles (III))

[0242] While the mill was operating, 70 g of methylhydrodiene polysiloxane (trade name: TSF484: manufactured by GE Toshiba Silicone Co., Ltd.) was added to 7.0 kg of silica particles (particle shape: spherical, original average particle size) 3.22μm, sphericity is 1.02, BET specific surface area value is 0.8m 2 / g, the liquidity index is 48, L * The value is 93.2, a * The value is 0.4, b * Value is 0.6, C * In the value 0.7), mixing and stirring were performed for 30 minutes with a line load of 588 N / cm (60 Kg / cm). And the stirring speed at this time was 22 rpm.

[0243] Then, while the crusher is running, 700g of carbon black (particle shape: granular, original average particle size is 0.022μm, and BET specific surface area value is 133.5 m) within 30 minutes. 2 / g, L * The value is 14.6), and then mixed and stirred for 30 minutes with a line load of 588N / cm (60Kg / cm) to make the carbon black adhere to the methylhydrodiene...

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PUM

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Abstract

The invention relates to a black composite particles for semiconductor sealing material and a semiconductor sealing material using the same. Black composite particles for semiconductor sealing material, comprise: an extender pigment as a core particle; and a black pigment provided on the surface of the extender pigment in an amount of 1 to 100 parts by weight per 100 parts by weight of the extender pigment. Such black composite particles not only exhibit enhanced blackness, moisture resistance, fluidity and tinting strength but also show an excellent dispersibility in binder resins. The resulting semiconductor sealing material is capable of exhibiting a high volume resistivity as well as excellent blackness, moisture resistance, soldering heat resistance, flowability and flexural strength.

Description

Technical field [0001] The present invention relates to black composite particles for semiconductor sealing materials and semiconductor sealing materials, in particular to black composite particles for semiconductor sealing materials with high blackness, moisture resistance, fluidity and coloring power, and good dispersibility to binder resin. And using the black composite particles, a semiconductor sealing material with high volume resistivity, blackness, moisture resistance, solder heat resistance, flowability, and flexural strength. Background technique [0002] At present, in order to physically and chemically protect electronic components such as ICs, LSIs, transistors, semiconductor switching elements, and diodes, while fixing these components, it is necessary to seal them with thermosetting resin. [0003] In recent years, with the increase in the size of plastic packages used for sealing, silica particles as fillers have been added to semiconductor sealing materials in or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L21/312C09C1/30
CPCC01P2006/12H01L23/293H01L21/3122C09C1/3054H01L21/02118C09C1/309C09C1/3081C01P2004/62Y10T428/2991C01P2004/61H01L2924/0002H01L21/02282H01L2924/00H01L21/56
Inventor 森井弘子下畑祐介林一之
Owner TODA IND
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